| Epoxy Resin Nā kikoʻī kikoʻī | Keʻano Packaging | Palapala noi | |||||||||||||
| Hoʻohālike | kalakala | Puka | Maikaʻi Paʻa (%) | EEW (g/eq) | Lae Palupalu (℃) | Chromaticity (G/H) | ʻO ka viscosity (mPa·s) | Hydrolyzable Chlorine (ppm) | Maʻiʻo Bromine (%) | Maʻiʻo Phosphorus (%) | Laʻana | ||||
| Bisphenol F Epoxy Resin | Epoxy resin solution ʻano bisphenol F maʻamau | EMTE160 | kala ole i Melemele Māmā | Waiwai | － | 155-165 | － | H≤20 | 1200-1600 | ≤150 | － | Pahu hao:240kg/pahu puolo IBC: 1000kg pahu pahu ISO:22tons | ʻO nā mea hoʻoheheʻe me ka ʻole o ka solvent, castings, adhesives, insulation material a me nā māla ʻē aʻe. | ||
| EMTE170 | kala ole | 165-175 | G≤1 | 3500-4500 | ≤100 |  | |||||||||
| Hoʻololi ʻia ʻo bisphenol F ʻano Epoxy resin solution | EMTE 207K70 | Melemele ʻulaʻula a ʻulaʻula | 70±1.0 | 500-600 | G＜8 | <3000 | <500 | － | Puke pahu hao hao: 220Kg. | Nā papa kaapuni i paʻi ʻia, nā laminate keleawe i uhi ʻia, nā mea hoʻopili, nā mea hoʻohuihui, nā laminates uila a me nā wahi huahana ʻē aʻe. | |||||
