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Hale Hana Kina no Kina CNMI Epoxy Resin aniani moakaka no ka uhi ʻana i ka papa ʻaina muliwai liʻiliʻi e hoʻolei ana i nā mea hoʻonani hana lima pā hoʻonani kahakai
"Ma muli o ka mākeke kūloko a me ka hoʻonui ʻana i ka ʻoihana ma waho" ʻo kā mākou hoʻolālā hoʻomohala no ka Hale Hana Kina no Kina CNMI Epoxy Resin aniani moakaka no ka uhi ʻana i ka papa ʻaina liʻiliʻi e hoʻolei ana i nā mea nani hana lima pā kai, hiki iā ʻoe ke loaʻa ke kumukūʻai haʻahaʻa loa ma aneʻi. E loaʻa pū kekahi iā ʻoe nā mea kiʻekiʻe a me nā lawelawe kupaianaha ma aneʻi! Mai kali e hoʻokaʻaʻike mai iā mākou!
"Ma muli o ka mākeke kūloko a hoʻonui i ka ʻoihana ma waho" ʻo kā mākou hoʻolālā hoʻomohala noKina Epoxy resin, ʻaʻohe ʻawahia ka resin epoxy, Me ke kumumanaʻo o ka lanakila-lanakila, ke manaʻolana nei mākou e kōkua iā ʻoe e loaʻa kālā hou aʻe ma ka mākeke. ʻAʻole ka hopu ʻana i kahi manawa kūpono, akā e hana ʻia. Hoʻokipa ʻia nā ʻoihana kālepa a i ʻole nā mea hoʻolaha mai nā ʻāina āpau.
Nā Kiʻi Noi
ʻO ka Resin Benzoxazines
Moʻo Resin Benzoxazine Low-DK
ʻO ka moʻo resin epoxy Bisphenol A
ʻO ka moʻo resin epoxy Bisphenol F
Moʻo resin epoxy phenolic
Moʻo resin epoxy i loaʻa ka phosphorus
Moʻo resin epoxy brominated
Moʻo resin epoxy i hoʻololi ʻia ʻo MDI
Moʻo resin epoxy macromolecular
Moʻo resin epoxy DCPD
Moʻo resin epoxy multifunctional
Moʻo resin epoxy kristal/wai
ʻO ka moʻo Phenol Formaldehyde Resin
Moʻo resin phenolic e loaʻa ana i ka phosphorus
Moʻo resin hydrocarbon i hoʻololi ʻia
Moʻo haku mele resin hydrocarbon
ʻEster Hana
Monomer Resin Kūikawā
Moʻo Resin Maleimide
ʻO ka Resin Benzoxazines
ʻO kā mākou hui ka hui mua e hoʻokō i ka hana ʻoihana nui o Benzoxazine Resin ma Kina, a aia ma ke kūlana alakaʻi i nā kahua hana, noi a me ka noiʻi o Benzoxazine Resin. Ua hala nā huahana Benzoxazine Resin o kā mākou hui i ka ʻike SGS, a ʻaʻohe o lākou halogen a me RoHS (Pb, CD, Hg, Gr (VI), PBBs, PBDEs) mau mea ʻino. ʻO ke ʻano, ʻaʻohe mole liʻiliʻi i hoʻokuʻu ʻia i ka wā o ke kaʻina hana hoʻōla a kokoke ʻole ka nui o ka shrinkage; Loaʻa i nā huahana hoʻōla nā ʻano o ka omo wai haʻahaʻa, ka ikehu ʻili haʻahaʻa, ke kūpaʻa UV maikaʻi, ke kūpaʻa wela maikaʻi loa, ke koena kalapona kiʻekiʻe, ʻaʻohe pono o ka catalysis waikawa ikaika a me ka curing open-loop. Hoʻohana nui ʻia i nā laminates i uhi ʻia i ke keleawe uila, nā laminates, nā mea composite, nā mea aerospace, nā mea friction a me nā kahua ʻē aʻe.
| Inoa | Papa Helu | helehelena | hoʻomālielie kiko (°C) | Manuahi Fenola (%) | GT (s @210℃) | Mānoanoa | NV (%) | nā waiwai |
| ʻAno MDA Benzoxazine | DFE125 | Wai moakāka ʻulaʻula ʻeleʻele | - | ≤ 5 | 100-230 | 30-70 (s,4# 杯） | 70±3 | ʻO ke kiʻekiʻe Tg, ke kūpaʻa wela kiʻekiʻe, ka pale ahi halogen-free, ka ikaika kiʻekiʻe a me ka paʻakikī |
| ʻAno BPA Benzoxazine | DFE127 | Wai melemele moakaka | - | ≤ 5 | 1100-1600 | 200-800 Mpa·s | 80 土 2 | ʻO ke modulus kiʻekiʻe, ke kūpaʻa wela kiʻekiʻe, ka pale ahi halogen-free, ka omo wai haʻahaʻa |
| ʻAno BPA Benzoxazine | DFE127A | Melemele paʻa | 60-85 | ≤ 5 | 500-800 | - | 98±1,5 | ʻO ke modulus kiʻekiʻe, ke kūpaʻa wela kiʻekiʻe, ka pale ahi halogen-free, ka omo wai haʻahaʻa |
| ʻAno BPF Benzoxazine | DFE128 | Wai moakāka ʻulaʻula ʻeleʻele | - | ≤ 5 | 350-400 | 30-100 (s，4# 杯） | 75±2 | Paʻakikī maikaʻi, kūpaʻa wela kiʻekiʻe, pale ahi halogen-free, hoʻemi wai haʻahaʻa a me ka mānoanoa haʻahaʻa |
| ʻAno ODA Benzoxazine | DFE129 | ʻUlaʻula ʻeleʻele moakaka | - | ≤ 2 | 120-500 | <2000 mpa.s | 65 土 3 | Tg: 212°C, Free PlienoK≤ 2%， Dk： 2.92, Df：0.0051 |
Moʻo Resin Benzoxazine Low-DK
ʻO ka Low dielectric Benzoxazine Resin kahi ʻano Benzoxazine Resin i hoʻomohala ʻia no ka laminate keleawe kiʻekiʻe a me ka wikiwiki kiʻekiʻe. Loaʻa i kēia ʻano resin nā ʻano o ka Dk / DF haʻahaʻa a me ke kūpaʻa wela kiʻekiʻe. Hoʻohana nui ʻia ia ma ka papa M2, M4 grade copper clad laminate a i ʻole HDI, papa multilayer, nā mea composite, nā mea friction, nā mea aerospace a me nā ʻoihana ʻē aʻe.
| Inoa | Papa Helu | helehelena | hoʻomālielie kiko rc> | Manuahi Fenola (%) | GT (s @210℃) | Mānoanoa | NV (%) | nā waiwai |
| ʻO ka benzoxazine dielectric haʻahaʻa | DFE130 | ʻAno melemele a paʻa nui paha | 55-80 | ≤ 5 | 400-600 | — | ≥98.5 | Dk: 2.75, Tg: 196 ℃： |
| Hoʻōla wikiwiki ʻia o ka benzoxazine ma ka mahana waena a me ka haʻahaʻa | DFE146 | Wai moakāka melemele ʻeleʻele | - | ≤ 5 | 100-130 | <200 (s，4# 杯） | 75±2 | Dk： 3.04, Df： 0.0039 Ka wikiwiki ho'ōla ki'eki'e, Tg ki'eki'e a me ka dielectric ha'aha'a |
| ʻO Benzoxazine me ka pilina pālua | DFE148 | Wai moakāka ʻulaʻula ʻeleʻele | - | ≤ 5 | ʻOiaʻiʻo ana | <2000 Mpa·s | 80±2 | Hiki iā ia ke hana me nā resins ʻē aʻe i loaʻa ka pilina pālua |
| Benzoxazine kaulahao nui | DFE149 | Wai moakāka melemele ʻeleʻele | - | ≤ 3 | 80-160 | <2000 Mpa·s | 70 土 2 | Tg： 215#C, Td5%： 380°C, Dk： 2.87, Df：0.0074 (10GHz) |
| ʻAno DCPD Benzoxazine | DFE150 | Wai ʻulaʻula ʻeleʻele moakaka | - | ≤ 3 | 2000-2500 | <1000 Mpa·s | 75±2 | Dk： 2.85, Df： 0.0073 (10GHz) |
| ʻO Bisphenol benzoxazine | DFE153 | Wai moakāka melemele ʻeleʻele | 一 | ≤ 3 | 100-200 | <2000 Mpa·s | 70±2 | Dk： 2.88, Df： 0.0076 (10GHz) |
ʻO ka moʻo resin epoxy Bisphenol A
ʻO kā mākou hui ʻo Bisphenol A epoxy resin me ka wai epoxy resin, ka paʻa epoxy resin a me ka solvent epoxy resin, nona ka hydrolysis chlorine haʻahaʻa a hoʻohana nui ʻia i nā uhi, nā mea uila, nā mea i hui pū ʻia a me nā ʻoihana ʻē aʻe.
| Inoa | Papa Helu | EEW (g/eq) | Waihoʻoluʻu (G) | Mānoanoa (mPa.s) | Hy-Cl (ppm) |
| ʻO ka resin epoxy bisphenol A wai | DFE1126 | 165-175 | ≤0.5 | 3000-5000 | <200 |
| DFE1127 | 180-190 | ≤1 | 8000-11000 | <500 | |
| DFE1128 | 184-194 | ≤1 | 12000-15000 | <500 | |
| DFE1128H | 184-194 | ≤1 | 12000-15000 | <100 | |
| Inoa | Papa Helu | EEW(g/eq) | Waihoʻoluʻu (G) | Wahi palupalu (℃) | |
| ʻO ka resin epoxy bisphenol A paʻa | DFE1011 | 450-500 | ≤1 | 60-70 | |
| DFE1901 | 450-500 | ≤1 | 65-75 | ||
| Inoa | Papa Helu | EEW (g/eq) | Waihoʻoluʻu (G) | Mānoanoa (mPa.s) | NV (%) |
| ʻAno wai bisphenol A epoxy resin | DFE1901EK70 | 450-500 | ≤1 | 2000-5000 | 70±1 |
ʻO ka moʻo resin epoxy Bisphenol F
Loaʻa i ka Bisphenol F epoxy resin nā ʻano o ka viscosity haʻahaʻa, ka wai maikaʻi a me ka maʻalahi o ka pulu ʻana, a loaʻa i kā mākou hui ka ʻenehana hana bisphenol F kūʻokoʻa me nā mea maka lawa. Hoʻohana nui ʻia nā huahana i nā uhi ʻole solvent, ka hoʻolei ʻana, nā mea hoʻopili, nā mea insulation a me nā ʻoihana ʻē aʻe.
| Inoa | Papa Helu | EEW (g/eq) | Mānoanoa (mPa·s) | Waihoʻoluʻu (G) | Hy-Cl (ppm) |
| ʻO ka resin epoxy bisphenol F wai | DFE1160 | 155-165 | ≤1600 | ≤1 | ≤100 |
| DFE1170L | 165-175 | 2900-3500 | ≤1 | ≤100 | |
| DFE1170 | 165-175 | 3500-4500 | ≤1 | ≤100 | |
| DFE1170H | 165-175 | 5000-6000 | ≤1 | ≤100 | |
| DFE1170K | 165-175 | 5000-6000 | ≤1 | ≤200 | |
| Inoa | Papa Helu | EEW (g/eq) | Waihoʻoluʻu (G) | Wahi palupalu (℃) | |
| ʻO ka resin epoxy bisphenol F paʻa | DFE1701 | 450-500 | ≤1 | 45-55 | |
| DFE1702 | 600-700 | ≤1 | 75-85 | ||
| DFE1703 | 700-800 | ≤1 | 85-95 | ||
| DFE1704D | 900-1000 | ≤1 | 90-100 | ||
| DFE1707D | 1300-1700 | ≤1 | 100-110 | ||
Moʻo resin epoxy phenolic
ʻO kā mākou mau resins epoxy phenolic e komo pū me ke ʻano PNE, ke ʻano BNE a me ke ʻano CNE. Loaʻa i kā lākou huahana i hoʻōla ʻia ke kiʻekiʻe o ka crosslinking density, ka ikaika hoʻopili maikaʻi loa, ke kūpaʻa wela a me ke kūpaʻa kemika. Hoʻohana nui ʻia lākou i nā laminates i uhi ʻia i ke keleawe uila, nā laminates uila, nā mea hoʻopili kūpaʻa wela, nā composites, nā uhi wela kiʻekiʻe, nā ʻenekinia kīwila a me nā ʻīnika uila.
| Inoa | Papa Helu | EEW (g/eq) | wahi palupalu (°C) | Waihoʻoluʻu (G) | Hy-Cl (ppm) |
| ʻAno PNE phenolic epoxy resin | DFE1638 | 171-180 | 36-40 | ≤0.5 | ≤200 |
| DFE1638S | 171-179 | 36-40 | ≤0.5 | ≤200 | |
| DFE1636 | 170-178 | 27-31 | <1 | <300 | |
| DFE1637 | 170-178 | 31-36 | <1 | <300 | |
| DFE1639 | 174-180 | 44-50 | <1 | <300 | |
| DFE1625 | 168-178 | 9000-13000mpa·s | ≤1 | <300 | |
| ʻO ka resin epoxy phenolic ʻano BNE | DFE1200 | 200-220 | 60-70 | <3 | <500 |
| DFE1200H | 205-225 | 70-80 | <3 | <500 | |
| DFE1200HH | 210-230 | 80-90 | <3 | <500 | |
| ʻO ka resin epoxy phenolic ʻano CNE | DFE1701 | 196-206 | 65-70 | <2 | <500 |
| DFE1702 | 197-207 | 70-76 | <2 | <500 | |
| DFE1704 | 200-215 | 88-93 | <2 | <1000 | |
| DFE1704M | 200-215 | 83-88 | <2 | <1000 | |
| DFE1704ML | 200-210 | 80-85 | <2 | <1000 | |
| DFE1704L | 207-215 | 78-83 | <2 | <1000 | |
| Inoa | Papa Helu | EEW (g/eq) | Mānoanoa (mPa.s) | NV (%) | |
| ʻAno hoʻonā phenolic epoxy resin | DFE236 | 200-220 | 1000-4000 | 80±1 | |
| DFE238 | 170-190 | 200-500 | 80 土 1 | ||
Moʻo resin epoxy i loaʻa ka phosphorus
ʻO nā resins epoxy i loaʻa ka phosphorus e komo pū ana me ʻekolu ʻano, ʻo ia hoʻi ke ʻano DOPO, DOPO-HQtype a me DOPO-NQtype. He maikaʻi loa lākou i ka pale ʻana i ka lapalapa a me ke kūʻē ʻana i ka wela, a he haʻahaʻa ka omo wai a me ka coefficient hoʻonui. No lākou ka resin epoxy pale ahi halogen-free, a kūlike me RoHS a me WEEE Directive. Hoʻohana nui ʻia lākou i ka papa kaapuni paʻi pale ahi halogen-free, ka laminate i uhi ʻia i ke keleawe uila, ka laminate uila a me nā kahua huahana ʻē aʻe.
| Inoa | Papa Helu | helehelena | NV (%) | EEW (g/eq) | Mānoanoa (mPa.s) | P% (%) |
| ʻO ka resin epoxy phenolic i hoʻololi ʻia ʻo DOPO-HQ | DFE200 | Wai ʻulaʻula ʻeleʻele moakaka | 70±1.0 | 320 ±20 | <1000 | 2.0±0.1 |
| ʻO ka resin epoxy phenolic i hoʻololi ʻia ʻo DOPO-HQ | DFE200A | Wai ʻulaʻula ʻeleʻele moakaka | 70±1.0 | 275 ±25 | <1000 | 1.0±0.1 |
| ʻO ka resin epoxy phenolic i hoʻololi ʻia ʻo DOPO-HQ | DFE200C | Wai melemele moakaka | 80±1.0 | 255 ±15 | 1000-7000 | 2.0±0.1 |
| ʻO ka resin epoxy phenolic i hoʻololi ʻia ʻo DOPO-HQ | DFE200D | Wai melemele moakaka | 80±1.0 | 230±20 | 1000-4000 | 1.0±0.1 |
| ʻO ka resin epoxy phenolic i hoʻololi ʻia ʻo DOPO-NQ | DFE201 | Wai ʻulaʻula ʻeleʻele moakaka | 75±1.0 | 330±30 | 1000-3000 | 2.5 ±0.1 |
| ʻO ka resin epoxy phenolic i hoʻololi ʻia ʻo DOPO-NQ | DFE201A | Wai ʻulaʻula ʻeleʻele moakaka | 75±1.0 | 330 土 10 | 1500-1700 | 2.5 ±0.1 |
| ʻO ka resin epoxy phenolic i hoʻololi ʻia ʻo DOPO | DFE202 | Wai moakāka melemele ʻole a ʻaʻohe kala | 75 ±1.0 | 315±20 | 1000-3000 | 3.1 ~ 3.2 |
| ʻO ka resin epoxy phenolic i hoʻololi ʻia ʻo DOPO | DFE202A | Wai ʻulaʻula ʻeleʻele moakaka | 70 ±1.0 | 300±20 | <2000 | 2.4±0.1 |
| ʻO ka resin epoxy phenolic i hoʻololi ʻia ʻo DOPO | DFE202B | Wai moakāka melemele ʻole a ʻaʻohe kala | 75±1.0 | 310±20 | ≤3000 | 2.8 ~ 3.2 |
| ʻO ka resin epoxy phenolic i hoʻololi ʻia ʻo DOPO | DFE202C | Wai maʻemaʻe a moakāka hoʻi | 75±1.0 | 300±20 | <3000 | 3.1 ±0.1 |
| ʻO ka resin epoxy phenolic i hoʻololi ʻia ʻo DOPO | DFE202D | Wai melemele māmā moakaka | 70±1.0 | 360 土 30 | ≤ 1500 | 2.5 ±0.2 |
Moʻo resin epoxy brominated
ʻO nā resins epoxy brominated kahi ʻano resins epoxy halogen flame retardant. Hana kā mākou hui i ka resin epoxy bromine kiʻekiʻe a me ka bromine haʻahaʻa, nona ka permeability maikaʻi i ka lole aniani, pale lapalapa maikaʻi loa a me ke kūpaʻa wela, a hoʻohana nui ʻia ma ke kahua o ka laminate keleawe i uhi ʻia me ka pale lapalapa ʻole halogen.
| Inoa | Papa Helu | helehelena | NV (%) | EEW (g/eq) | Mānoanoa (mPa.s) | Br% (%) |
| ka resin epoxy haʻahaʻa bromine | DFE271 | Wai moakāka melemele a ʻulaʻula paha | 80±1.0 | 250-280 | 200-800 | 11.5±1.0 |
| DFE274 | Wai moakāka melemele a ʻulaʻula paha | 75±1.0 | 280-320 | 200-1500 | 18-21 | |
| DFE276 | Wai moakāka melemele a ʻulaʻula paha | 75 土 1.0 | 340-380 | 200-400 | 18-21 | |
| DFE277 | Wai moakāka melemele a ʻulaʻula paha | 80±1.0 | 410-440 | 800-1800 | 18-21 | |
| DFE278 | Wai ʻulaʻula ʻeleʻele moakaka | 80±1.0 | 410-440 | 800-1800 | 18-21 | |
| Inoa | Papa Helu | helehelena | EEW (g/eq) | hoʻomālielie kiko (°C) | Br% (%) | |
| ka resin epoxy i loaʻa ka bromine kiʻekiʻe | DFE270 | ʻAʻohe kala a i ka melemele paʻa | 380-420 | 67-74 | 46-50 | |
Moʻo resin epoxy i hoʻololi ʻia ʻo MDI
ʻO ka resin epoxy i hoʻololi ʻia e MDI he epoxy i hoʻololi ʻia e Isocyanate me ka oxazolidinone i hoʻokomo ʻia i loko o ke kaulahao nui, nona ke kūpaʻa wela maikaʻi loa a me ka maʻalahi. Loaʻa ka huahana ma Boron free a me Boron i loaʻa, hiki ke hoʻoheheʻe ʻia i nā mea hoʻoheheʻe maʻamau e like me propylene glycol methyl ether, acetone, butanone, etc. Loaʻa iā ia ka hoʻohālikelike maikaʻi me dicyandiamide, phenolic curing agent, a kūpono ia no ke kahua laminate i uhi ʻia me ke keleawe ʻole halogen.
| Inoa | Papa Helu | helehelena | NV (%) | EEW (g/eq) | Mānoanoa (mPa.s) | Br% (%) |
| ʻO ka resin epoxy brominated i hoʻololi ʻia e MDI | DFE204 | Wai ʻulaʻula ʻeleʻele moakaka | 75±1.0 | 330-370 | 500-2000 | 16.5-18 |
| DFE204A | Wai ʻulaʻula ʻeleʻele moakaka | 75±1.0 | 330-370 | 500-2000 | 16.5-18 | |
| ʻO ka resin epoxy i hoʻololi ʻia e MDI | DFE205 | Wai moakāka ʻeleʻele melemele | 75 ±1.0 | 250-310 | 500-2500 | - |
| DFE205A | Wai moakāka ʻeleʻele melemele | 75 ±1.0 | 270-330 | 500-2500 | - |
Moʻo resin epoxy macromolecular
ʻO nā resins epoxy macromolecular kahi ʻano o nā resins epoxy bisphenol A/F i hoʻololi ʻia, nona nā iwi molekala palupalu a me nā ʻāpana kaulahao molekala lōʻihi, a he palupalu a me ka hoʻopili maikaʻi loa. Hoʻohana pinepine ʻia lākou i nā ʻōnaehana resin epoxy e hoʻonui i ka palupalu a me ka hoʻopili ʻana, a hoʻomaikaʻi i ke kahe ʻana o ka resin. He kūpono lākou no ka papa kaapuni i paʻi ʻia, ka laminate keleawe uila, ka mea hoʻopili, nā mea hui, ka laminate uila a me nā huahana ʻē aʻe.
| Inoa | Papa Helu | helehelena | NV (%) | ʻEEW (g/eq) | Mānoanoa (mPa.s) |
| ʻO ka resin epoxy bisphenol A i hoʻololi ʻia | DFE206 | Wai moakāka melemele ʻole a ʻaʻohe kala | 75 土 1.0 | 470±30 | 500-3000 |
| ʻO ka resin bisphenol Fepoxy i hoʻololi ʻia | DFE207 | Wai moakaka melemele māmā a ʻulaʻula ʻeleʻele | 70±1.0 | 550 ±50 | 500-3000 |
Moʻo resin epoxy DCPD
ʻO ka DCPD epoxy resin kahi ʻano linear multifunctional epoxy resin me Dk / DF haʻahaʻa, kūpaʻa wela maikaʻi loa, haʻahaʻa haʻahaʻa, hoʻopili kiʻekiʻe a me ke kūpaʻa kemika. Hoʻohana nui ʻia ia i ka laminate keleawe kiʻekiʻe a me ka wikiwiki kiʻekiʻe, nā mea hoʻoheheʻe, nā uhi lapalapa, nā mea hoʻopili lapalapa a me nā ʻoihana ʻē aʻe.
| Inoa | Papa Helu | EEW (g/eq) | wahi palupalu (°C) | Hy-Cl (ppm) |
| ʻO ka resin epoxy DCPD paʻa | DFE211LL | 260-275 | 53-60 | <300 |
| DFE211L | 265-275 | 60-70 | <300 | |
| DFE211 | 260-280 | 70-80 | <300 | |
| DFE211H | 260-280 | 80-90 | <300 | |
| DFE211HH | 265-285 | 90-100 | <300 | |
| Inoa | Papa Helu | EEW (g/eq) | NV (%) | Mānoanoa (mPa.s) |
| Hoʻonā resin epoxy DCPD | DFE210 | 260-280 | 75±1 | 200-800 |
Moʻo resin epoxy multifunctional
ʻO ka resin epoxy multifunctional kahi ʻano resin epoxy me ʻekolu a ʻehā paha kekelē hana. Loaʻa iā ia nā ʻano o ke kiʻekiʻe o ka cross-linking density, ke kūpaʻa wela maikaʻi, ka hoʻōla wikiwiki, ka ikaika kiʻekiʻe a me ke kūpaʻa kemika maikaʻi loa. Hoʻohana nui ʻia ia ma nā kahua o ka laminate keleawe uila a me nā mea i hui pū ʻia.
DFE250
DFE254
DFE256
DFE258
| Inoa | Papa Helu | EEW (g/eq) | Waihoʻoluʻu (G) | Hy-Cl (ppm) |
| ʻO ka resin epoxy Tetrafictional | DFE250 | 195-230 | ≤18 | - |
| ʻO ka resin epoxy multifunctional kūpaʻa wela kiʻekiʻe | DFE254 | 110-120 | <11 | <1000 |
| DFE256 | 90-110 | <11 | <1000 | |
| ʻO ka resin epoxy trifunctional | DFE258 | 155-175 | <18 | <1000 |
| Inoa | Papa Helu | EEW (g/eq) | NV (%) | Mānoanoa (mPa.s) |
| Hoʻonā resin epoxy Tetrafunctional | DFE251 | 200-240 | 70 士 1 | 50-250 |
Moʻo resin epoxy kristal/wai
ʻO ka resin epoxy crystalline (wai kristal) he mau ʻano o ka viscosity haʻahaʻa, ke kūpaʻa wela, ke kahe kiʻekiʻe, ka coefficient haʻahaʻa o ka hoʻonui linear a me ka omo wai haʻahaʻa, kahi i hoʻohana nui ʻia i ka laminate keleawe uila, nā mea i hui pū ʻia a me nā ʻoihana ʻē aʻe.
DFE260
DFE261
DFE262
DFE264
| Inoa | Papa Helu | EEW (g/eq) | wahi hoʻoheheʻe / palupalu (°C) | Hy-Cl (ppm) | nā waiwai |
| ʻO ka resin epoxy phenolic biphenyl | DFE260 | 280-300 | 65-75 | <300 | Dielectric haʻahaʻa, kūpaʻa wela kiʻekiʻe |
| ʻO ka resin Epoxy kristal wai Biphenyl | DFE261 | 184-192 | >100 | <300 | Haʻahaʻa ka mānoanoa, kiʻekiʻe ka hoʻokele wela |
| ʻO ka resin Epoxy BHQBiphenyl Crystalline | DFE262 | 168-180 | >136 | <300 | Haʻahaʻa ka mānoanoa, pale ahi |
| ʻO ka resin epoxy Tetramethylbisphenol F | DFE264 | 190-210 | >69 | <300 | Haʻahaʻa ka mānoanoa, haʻahaʻa ka dielectric |
ʻO ka moʻo Phenol Formaldehyde Resin
ʻO ka resin phenolic linear kahi resin phenolic maikaʻi a kiʻekiʻe i hoʻomohala ʻia no ka ʻoihana mea uila. Hōʻike ʻia ia e ke kala māmā, ka hoʻolaha kaumaha molekala haiki a me ka haʻahaʻa o ka phenol manuahi (hiki ke hoʻemi ʻia ka haʻahaʻa i l00ppm). Hoʻohana nui ʻia ia i ka laminate i uhi ʻia i ke keleawe uila, ka hoʻopili semiconductor a me nā ʻoihana ʻē aʻe. Eia kekahi, ʻoiai e hāʻawi ana i nā mea kūʻai aku me nā huahana kiko palupalu kikoʻī, hiki i kā mākou hui ke hāʻawi i ka hopena resin butanone me ka ʻike paʻa o 60% - 70% e like me ke koi.
| Inoa | Papa Helu | helehelena | hoʻomālielie kiko (°C) | Phenol manuahi (%) | ʻIkepili ʻAʻole Volatile (%) | like hydroxyl (g/eq) |
| ʻO ka Phenol Formaldehyde Resin | DFE308 | ʻAʻohe kala a i melemele māmā moakaka paʻa | 84 土 3 | <0.05 | ≥ 99.5 | 106±2 |
| DFE309 | 95±3 | <0.05 | ≥ 99.5 | 106±2 | ||
| DFE310 DFE311 | 98±3 | ≤0.1 | ≥ 99.5 | 106±3 | ||
| 105 ±3 | ≤0.1 | ≥99.5 | 106±3 | |||
| DFE312 | 115±3 | ≤0.1 | ≥99.5 | 106±3 | ||
| ʻO ka resin phenolic ʻano BP A | DFE322 | Paʻa melemele a ʻulaʻula ʻeleʻele | 122 ±3 | ≤0.1 | ≥99.5 | 118±3 |
Moʻo resin phenolic e loaʻa ana i ka phosphorus
Loaʻa i ka resin phenolic me ka phosphorus ka nui o ka phosphorus a me ka pale ahi maikaʻi, hiki ke hoʻopiha no ka hemahema o ka haʻahaʻa o ka phosphorus i loko o ka resin epoxy me ka phosphorus. He kūpono ia no ka laminate keleawe uila, ka hoʻopili capacitor, ka laminate uila a me nā ʻoihana ʻē aʻe.
| Inoa | Papa Helu | helehelena | NV (%) | P% (%) | Mānoanoa (cps) | like hydroxyl (g/eq) | nā waiwai |
| ʻO ka resin phenolic i hoʻopili ʻia me ka phosphorus | DFE392 | Wai melemele moakaka | 60 ±1.0 | 8.9 ~ 9.2 | 400—3000 | 360~400 | Maikaʻi ka pale ʻana i ka lapalapa |
| DFE394 | Wai melemele moakaka | 60 ±1.0 | 8.9 ~ 9.2 | 3000~5000 | 320~360 | Hana kiʻekiʻe a me ka pale ʻana i ke ahi | |
| DFE395 | Wai melemele moakaka | 56±1,0 | 8.9 ~ 9.2 | 1000~4000 | 320~360 | Hana kiʻekiʻe a me ka pale ʻana i ke ahi | |
| D992-2 | Melemele a ʻeleʻele moakaka | 60 ±1,0 | 8,6 ~8.8 | 400—3000 | 320~360 | Kumukūʻai haʻahaʻa, pale ahi maikaʻi | |
| D994 | Wai melemele moakaka | 60 ±1,0 | 8.9 ~ 9.2 | 400~3000 | 320~360 | Hana kiʻekiʻe a me ka pale ʻana i ke ahi |
Moʻo resin hydrocarbon i hoʻololi ʻia
ʻO ka moʻo resin hydrocarbon kahi ʻano resin substrate alapine kiʻekiʻe koʻikoʻi ma ke kahua 5g. Ma muli o kona ʻano kemika kūikawā, he haʻahaʻa ka dielectric, kūpaʻa wela maikaʻi loa a me ke kūpaʻa kemika. Hoʻohana nui ʻia ia i nā laminates i uhi ʻia i ke keleawe 5g, nā laminates, nā mea pale ahi, ka pena insulating pale wela kiʻekiʻe, nā mea hoʻopili a me nā mea hoʻolei. Hoʻokomo pū ʻia nā huahana i ka resin hydrocarbon i hoʻololi ʻia a me ka haku mele resin hydrocarbon.
ʻO ka resin hydrocarbon i hoʻololi ʻia kahi ʻano resin hydrocarbon i loaʻa e kā mākou hui ma o ka hoʻololi ʻana i nā mea maka hydrocarbon. Loaʻa iā ia nā waiwai dielectric maikaʻi, ka nui o ka vinyl, ka ikaika ʻili kiʻekiʻe, a me nā mea ʻē aʻe, a hoʻohana nui ʻia i nā mea alapine kiʻekiʻe.
| Inoa | Papa No | helehelena | NV (%) | Mānoanoa (mPa.s) | nā waiwai |
| ʻO ka resin styrene butadiene i hoʻololi ʻia | DFE401 | Wai melemele māmā | 35±2.0 | <3000 | ʻO ke kaumaha molekala kiʻekiʻe a me ka dielectric haʻahaʻa. Hoʻohana nui ʻia i ka resin hydrocarbon, polyphenylene ether a me ka ʻōnaehana resin peek |
| ʻO ka resin Epoxy i hoʻololi ʻia ka resin styrene butadiene | DFE402 | Wai ʻole kala a melemele | 60±2.0 | <5000 | ʻO ka epoxy i hoʻololi ʻia ʻo Anhydride me nā waiwai dielectric haʻahaʻa hoʻohana nui ʻia i nā mea wikiwiki |
| ʻO ka resin styrene butadiene me nā waiwai dielectric haʻahaʻa | DFE403 | 60±2.0 | <2000 | ʻO ka nui o ka vinyl, ka nui o ka crosslinking density, i hoʻohana nui ʻia i ka hydrocarbon resin, polyphenylene ether a me ka ʻōnaehana peek resin | |
| ʻO ka resin hydrocarbon i hoʻololi ʻia | DFE404 | 40+2.0 | <2000 | Dielectric haʻahaʻa, omo wai haʻahaʻa, ikaika ʻili kiʻekiʻe | |
| ʻO ka resin polystyrene i hoʻololi ʻia | DFE405 | 60 土 2.0 | <3000 | ʻO ka nui o ka vinyl, ka nui o ka crosslinking density, i hoʻohana nui ʻia i ka hydrocarbon resin, polyphenylene ether a me ka ʻōnaehana peek resin | |
| ʻO ka resin hydrocarbon i hoʻololi ʻia | DFE406 | 35±2.0 | <2000 | ʻO ka omo wai haʻahaʻa, ka ikaika ʻili kiʻekiʻe, ʻoi aku ka maikaʻi o ka dielectric nā waiwai | |
| ka resin hydrocarbon | DFE412 | Wai melemele māmā | 50 土 2.0 | <8000 | ʻO ke modulus kiʻekiʻe, ke kaumaha molekala kiʻekiʻe a me ka dielectric haʻahaʻa |
| ʻO ka resin hoʻopaʻa pālua me nā waiwai dielectric haʻahaʻa | DFE416 | Wai ʻole kala a melemele | 60+2.0 | <2000 | ʻO ka nui o ka vinyl, ka nui o ka crosslinking density, i hoʻohana nui ʻia i ka hydrocarbon resin, polyphenylene ether a me ka ʻōnaehana peek resin |
Moʻo haku mele resin hydrocarbon
ʻO ka hui hydrocarbon resin composite kahi ʻano hui hydrocarbon resin i hoʻomohala ʻia e kā mākou hui no ke kamaʻilio 5g. Ma hope o ke kuʻi ʻana, ka maloʻo ʻana, ka laminating a me ke kaomi ʻana, loaʻa i ka hui nā waiwai dielectric maikaʻi loa, ka ikaika ʻili kiʻekiʻe, ke kūpaʻa wela maikaʻi a me ka pale ʻana i ka lapalapa maikaʻi. Hoʻohana nui ʻia ia ma ke kahua kumu 5g, antenna, amplifier mana, radar a me nā mea alapine kiʻekiʻe ʻē aʻe. Loaʻa i kā mākou hui ka resin carbon ma o ka hoʻololi ʻana i nā mea maka hydrocarbon. Loaʻa iā ia nā waiwai dielectric maikaʻi, ka nui o ka vinyl, ka ikaika ʻili kiʻekiʻe, a pēlā aku, a hoʻohana nui ʻia i nā mea alapine kiʻekiʻe.
| Inoa | Papa Helu | helehelena | NV (%) | nā waiwai |
| ʻO ka haku mele ʻana o ka resin hydrocarbon | DFE407 | Wai keʻokeʻo a melemele | 65 ±2.0 | Dk/Df： 3.48/0.0037 Hoʻohana nui ʻia i ka mea hoʻonui mana (V0) |
| DFE407A | 65 ±2.0 | Dk: 3.52 ʻO ke kahe kiʻekiʻe, i hoʻohana nui ʻia i ka hana ʻana o ka mea hoʻopili pepa | ||
| DFE408 | 65 ±2.0 | Dk/Df： 3.00/0.0027 Hoʻohana nui ʻia ma ke kahua kumu a me ka antenna (papa multilayer, flame retardant V0) | ||
| DFE408A | 65 ±2.0 | Dk: 3.00 ʻO ke kahe kiʻekiʻe, i hoʻohana nui ʻia i ka hana ʻana o ka mea hoʻopili pepa | ||
| DFE409 | 65 ±2.0 | Dk/Df： 3.30/0.0027 Hoʻohana nui ʻia i ka antenna (papa ʻelua ʻaoʻao, ʻaʻole lapalapa ahi V0) | ||
| DFE410 | 65 ±2.0 | Dk/Df： 3.40/0.0029 Hoʻohana nui ʻia i ka antenna (papa ʻelua ʻaoʻao, ʻaʻole lapalapa ahi V0) | ||
| DFE411 | 65 土 2.0 | Dk/Df： 3.38/0.0027 Hoʻohana nui ʻia i ka mea hoʻonui mana (ʻaʻole e pale aku i ka lapalapa) |
ʻEster Hana
Hoʻopili ka mea hoʻōla ester ikaika me ka resin epoxy e hana i kahi grid me ka ʻole o ka hui hydroxyl waiʻona lua. Loaʻa i ka ʻōnaehana hoʻōla nā ʻano o ka omo wai haʻahaʻa a me ka Dk / Df haʻahaʻa.
| Inoa | Papa Helu | helehelena | ʻO ke ʻano like o ka Ester | NV (%) | ʻO ka mānoanoa (viscosity) | wahi palupalu rc) |
| Mea ho'ōla ester hana dielectric haʻahaʻa | DFE607 | Wai mānoanoa ʻeleʻele māmā | 230~240 | 69 ±1.0 | 1400~1800 | 140~150 |
| DFE608 | Wai ʻulaʻula ʻeleʻele | 275-290 | 69±1.0 Nā mea paʻa i loaʻa | 800-1200 | 140-150 | |
| DFE609 | Wai ʻeleʻele | 275-290 | 130-140 | |||
| DFE610 | Wai ʻeleʻele | 275-290 | 100-110 |
Monomer Resin Kūikawā
ʻOi aku ka nui o ka phosphorus ma mua o 13%, ʻoi aku ka nui o ka naikokene ma mua o 6%, a maikaʻi loa ke kūpaʻa hydrolysis. He kūpono ia no ka laminate i uhi ʻia i ke keleawe uila, ka hoʻopili capacitor a me nā kahua ʻē aʻe.
ʻO ka BIS-DOPO ethane kahi ʻano hui phosphate organic, he halogen-free flame retardant kaiapuni. He pauka keʻokeʻo paʻa ka huahana. Loaʻa i ka huahana ke kūpaʻa wela maikaʻi loa a me ke kūpaʻa kemika, a ʻoi aku ka mahana o ka decomposition thermal ma mua o 400 °C. He huahana pale ahi maikaʻi loa kēia a aloha i ke kaiapuni. Hiki iā ia ke hoʻokō piha i nā koi kaiapuni o ka European Union. Hiki ke hoʻohana ʻia ma ke ʻano he pale ahi i ke kahua o ka laminate i uhi ʻia i ke keleawe. Eia kekahi, he kūpono loa ka huahana me ka polyester a me ka nylon, no laila he spinnability maikaʻi loa i ke kaʻina hana milo, nā waiwai milo mau a me ke kala maikaʻi, a hoʻohana nui ʻia hoʻi i ke kahua o ka polyester a me ka nylon.
| Inoa | Papa No | helehelena | hoʻoheheʻe ʻana kiko （℃） | P% % | N% (%) | Td5%（℃） | Nā Waiwai |
| Mea hoʻopau lapalapa Phosphazene | DFE790 | Pauka keʻokeʻo a melemele paha | 108 ±4.0 | ≥13 | ≥6 | ≥320 | ʻOi aku ka nui o ka phosphoms, pale lapalapa, kūpaʻa wela kiʻekiʻe, kūpaʻa hydrolysis, kūpono no ka laminate i uhi ʻia i ke keleawe a me nā mahina ʻē aʻe |
| Inoa | Papa No | helehelena | ʻike % | hoʻoheheʻe ʻana kiko CC) | P% % | Td2% V | Nā Waiwai |
| ʻEtane BIS-DOPO | DFE791 | Pauka keʻokeʻo | ≥99 | 290-295 | ≥13 | ≥400 | Ka nui o ka ion chloride< 20ppm, kiʻekiʻe ke kiko heheʻe, kiʻekiʻe ka mahana o ka haki ʻana, haʻahaʻa ke ana hoʻololi |
Moʻo Resin Maleimide
ʻO DFE930n DFE936> DFE937, DFE939^ DFE950 a me DFE952 he mau resin maleimide papa uila me ka maʻemaʻe kiʻekiʻe, ka liʻiliʻi o nā haumia a me ka solubility maikaʻi. Ma muli o ke ʻano o ke apo imine i loko o ka mole, he paʻakikī ko lākou a me ke kūpaʻa wela maikaʻi loa. Hoʻohana nui ʻia lākou i nā mea hana aerospace, nā ʻāpana hana kūpaʻa wela kiʻekiʻe o ke kalapona fiber, ka pena impregnating kūpaʻa wela kiʻekiʻe, nā laminates, nā laminates i uhi ʻia i ke keleawe, nā plastics i hoʻoheheʻe ʻia, a me nā mea ʻē aʻe. Papa kaapuni paʻi kiʻekiʻe, nā mea kūpaʻa ʻaʻahu, ka mea hoʻopili huila daimana, nā mea magnetic, nā ʻāpana hoʻolei a me nā mea hana ʻē aʻe a me nā kahua ʻenehana kiʻekiʻe ʻē aʻe.
| Inoa | Papa ʻAʻole | helehelena | Hoʻoheheʻe ʻia kiko (℃) | Ka Waiwai ʻAkika (mg KOH/g) | Lelelele ʻike (%) | (5mm) Ka hiki ke hoʻoheheʻe ʻia o ka toluene wela (5min) | Nā Waiwai |
| ʻO Bismaleimide papa uila | DFE928 | Nā ʻāpana paʻa melemele | 158±2 | ≤3.0 | ≤0.3 | Hoʻoheheʻe piha ʻia | Ke kūpaʻa wela kiʻekiʻe |
| ʻO ka diphenylmethane papa uila Bismaleimide | DFE929 | Nā ʻāpana paʻa melemele māmā | 162 ±2 | ≤1.0 | ≤0.3 | Maʻemaʻe kiʻekiʻe a me ka waiwai waikawa haʻahaʻa | |
| Bismaleimide papa uila | DFE930 | Pauka keʻokeʻo melemele māmā | 160 ±2 | ≤1.0 | ≤0.3 | Kiʻekiʻe ka maʻemaʻe a me ka haʻahaʻa o ka waikawa^lue | |
| Bismaleimide crystalline haʻahaʻa | DFE936 | 168 ±2 | ≤1.0 | ≤0.3 | Maikaʻi ka hoʻoheheʻe ʻana | ||
| ʻO Bismaleimide crystalline haʻahaʻa a me ka dielectric haʻahaʻa | DFE937 | 168 ±2 | ≤1.0 | ≤0.3 | Maikaʻi ka hoʻoheheʻe ʻana | ||
| ʻO ka Phenyl bismaleimide me kahi hoʻoheheʻe haʻahaʻa | DFE939 | Pauka paʻa ʻeleʻele māmā a melemele paha | 50 土 10 | ≤3.0 | ≤0.3 | Maikaʻi ka hoʻoheheʻe ʻana | |
| Polymaleimide wahi heheʻe haʻahaʻa | DFE950 | 50 ±10 | ≤3.0 | ≤0.3 | Maikaʻi ka hoʻoheheʻe ʻana | ||
| Haʻahaʻa heheʻe mg kiko tetramaleirnide | DFE952 | 50 ±10 | ≤3.0 | ≤0.3 | Maikaʻi ka hoʻoheheʻe ʻana |
"Ma muli o ka mākeke kūloko a me ka hoʻonui ʻana i ka ʻoihana ma waho" ʻo kā mākou hoʻolālā hoʻomohala no ka Hale Hana Kina no Kina CNMI Epoxy Resin aniani moakaka no ka uhi ʻana i ka papa ʻaina liʻiliʻi e hoʻolei ana i nā mea nani hana lima pā kai, hiki iā ʻoe ke loaʻa ke kumukūʻai haʻahaʻa loa ma aneʻi. E loaʻa pū kekahi iā ʻoe nā mea kiʻekiʻe a me nā lawelawe kupaianaha ma aneʻi! Mai kali e hoʻokaʻaʻike mai iā mākou!
Hale Hana Kina noKina Epoxy resin, ʻaʻohe ʻawahia ka resin epoxy, Me ke kumumanaʻo o ka lanakila-lanakila, ke manaʻolana nei mākou e kōkua iā ʻoe e loaʻa kālā hou aʻe ma ka mākeke. ʻAʻole ka hopu ʻana i kahi manawa kūpono, akā e hana ʻia. Hoʻokipa ʻia nā ʻoihana kālepa a i ʻole nā mea hoʻolaha mai nā ʻāina āpau.
