Mea hoʻolako honua no ka mālama ʻana i ke kaiapuni
A me ka Palekana Mea Hou
ʻO ka hale hana Kina no Kina CNMI Epoxy Resin maʻemaʻe no ka uhi ʻana i nā pākaukau liʻiliʻi e hoʻolei ana i ka muliwai.
"Ma muli o ka mākeke kūloko a me ka hoʻonui ʻana i nā ʻoihana ʻē aʻe" ʻo kā mākou papahana hoʻomohala no China Factory no Kina CNMI Epoxy Resin aniani akaka no ka uhi ʻana i ka liʻiliʻi liʻiliʻi liʻiliʻi o ka muliwai papaʻaina mea hoʻonaninani pā hale, hiki iā ʻoe ke loaʻa ke kumu kūʻai haʻahaʻa loa ma aneʻi. E loaʻa nō hoʻi iā ʻoe nā mea waiwai maikaʻi a me nā lawelawe maikaʻi ma aneʻi! E ʻoluʻolu, mai kali e hopu iā mākou!
"Ma muli o ka mākeke kūloko a hoʻonui i ka ʻoihana ma waho" ʻo kā mākou hoʻolālā hoʻomohala noKina Epoxy resin, resin epoxy ʻona ʻole, Me ke kumu o ka win-win, ke manaʻolana nei mākou e kōkua iā ʻoe e hoʻonui i ka loaʻa kālā ma ka mākeke. ʻAʻole e hopu ʻia kahi manawa, akā e hana ʻia. Hoʻokipa ʻia nā hui kālepa a i ʻole nā mea hoʻolaha mai kekahi ʻāina.
Nā kiʻi noiʻi
Benzoxazines Resin
ʻO ka moʻo haʻahaʻa ʻo Benzoxazine Resin
Bisphenol He moʻo epoxy resin
Bisphenol F epoxy resin moʻo
Phenolic epoxy resin moʻo
ʻO ka Phosphorus i loaʻa i ka epoxy resin series
Brominated epoxy resin moʻo
MDI hoʻololi epoxy resin moʻo
Macromolecular epoxy resin moʻo
DCPD epoxy resin moʻo
Nā moʻo epoxy resin multifunctional
ʻO ka moʻo ʻeleʻele epoxy resin kristal/wai
Phenol Formaldehyde Resin moʻo
ʻO ka Phosphorus i loaʻa ka phenolic resin series
ʻO ka moʻo resin hydrocarbon i hoʻololi ʻia
ʻO ka pūʻulu haku mele hydrocarbon resin
Ester ʻeleu
Monomer Resin Kūikawā
Maleimide Resin moʻo
Benzoxazines Resin
ʻO kā mākou hui ka hui mua i ʻike i ka hana ʻoihana nui o Benzoxazine Resin ma Kina, a aia i ke kūlana alakaʻi i ka hana, noiʻi a me nā kahua noiʻi o Benzoxazine Resin. Ua hala nā huahana Benzoxazine Resin o kā mākou hui i ka ʻike SGS, a ʻaʻole i loaʻa nā mea ʻino a me RoHS (Pb, CD, Hg, Gr (VI), PBB, PBDE). ʻO ka hiʻohiʻona, ʻaʻohe mole liʻiliʻi i hoʻokuʻu ʻia i ka wā o ke kaʻina hana hoʻōla a ʻaneʻane ʻaʻole ka emi ʻana o ka leo; Loaʻa i nā huahana curing nā hiʻohiʻona o ka haʻahaʻa wai haʻahaʻa, haʻahaʻa haʻahaʻa ikehu, maikaʻi UV kū'ē, maikaʻi wela kū'ē, kiʻekiʻe koena kalapona,ʻaʻohe pono o ka ikaika acid catalysis a open-loop curing.lt ua hoʻohana nui 'ia i loko o ka uila keleawe aahu laminates, laminates, composite mea, aerospace mea, friction mea a me na kula.
| Inoa | Papa No | Ka nana aku | hooluolu kiko (°C) | Kuokoa Phenol (%) | GT (s @210℃） | ʻO ka viscosity | NV (%) | waiwai |
| MDA ʻano Benzoxazine | DFE125 | ʻulaʻula ʻulaʻula ʻulaʻula ʻulaʻula | - | ≤ 5 | 100-230 | 30-70 (s,4# 杯） | 70±3 | Tg kiʻekiʻe, kūpaʻa wela kiʻekiʻe, pale ahi ʻole halogen, ikaika kiʻekiʻe a paʻakikī |
| ʻO ka ʻano BPA Benzoxazine | DFE127 | ʻO ka wai aniani melemele | - | ≤ 5 | 1100-1600 | 200-800 Mpa·s | 80 土 2 | ʻO ka modulus kiʻekiʻe, ke kūpaʻa wela kiʻekiʻe, ka pale ahi ʻole halogen, ka haʻahaʻa o ka wai |
| ʻO ka ʻano BPA Benzoxazine | DFE127A | Melemele paʻa | 60-85 | ≤ 5 | 500-800 | - | 98±1,5 | ʻO ka modulus kiʻekiʻe, ke kūpaʻa wela kiʻekiʻe, ka pale ahi ʻole halogen, ka haʻahaʻa o ka wai |
| ʻO ka BPF ʻano Benzoxazine | DFE128 | ʻulaʻula ʻulaʻula ʻulaʻula ʻulaʻula | - | ≤ 5 | 350-400 | 30-100 (s，4# 杯） | 75±2 | ʻO ka paʻakikī maikaʻi, ke kūpaʻa wela kiʻekiʻe, ka pale ahi ʻole halogen, ka haʻahaʻa wai haʻahaʻa a me ka viscosity haʻahaʻa. |
| ʻO ka ʻano ODA Benzoxazine | DFE129 | ʻulaʻula ʻulaʻula ʻalohi | - | ≤ 2 | 120-500 | <2000 mpa.s | 65 土 3 | Tg: 212°C, Free PlienoK≤ 2%， Dk: 2.92, Df：0.0051 |
ʻO ka moʻo haʻahaʻa ʻo Benzoxazine Resin
ʻO Benzoxazine Resin dielectric haʻahaʻa he ʻano Benzoxazine Resin i hoʻomohala ʻia no ke alapine kiʻekiʻe a me ka wikiwiki o ka laminate copper clad. ʻO kēia ʻano resin nā hiʻohiʻona o Dk / DF haʻahaʻa a me ke kūpaʻa wela kiʻekiʻe. Hoʻohana nui ʻia ia i ka M2, M4 grade copper clad laminate a i ʻole HDI board, multilayer board, composite material, friction material, aerospace a me nā māla ʻē aʻe.
| Inoa | Papa No | Ka nana aku | hooluolu kiko rc> | Kuokoa Phenol (%) | GT (s @210℃） | ʻO ka viscosity | NV (%) | waiwai |
| Benzoxazine dielectric haʻahaʻa | DFE130 | ʻO ke kala melemele a i ʻole ka paʻa nui | 55-80 | ≤ 5 | 400-600 | — | ≥98.5 | Dk: 2.75, Tg:196 ℃: |
| Ho'ōla wikiwiki i ka benzoxazine ma ka wela haʻahaʻa | DFE146 | ʻO ka wai aniani melemele ʻeleʻele | - | ≤ 5 | 100-130 | <200 (s，4# 杯） | 75±2 | Dk: 3.04, Df: 0.0039 Kiʻekiʻe hoʻōla wikiwiki, kiʻekiʻe Tg a haʻahaʻa dielectric |
| ʻO Benzoxazine me ka paʻa pālua | DFE148 | ʻulaʻula ʻulaʻula ʻulaʻula ʻulaʻula | - | ≤ 5 | ʻOiaʻiʻo ana ana | <2000 Mpa·s | 80±2 | Hiki iā ia ke hana me nā resins ʻē aʻe i loaʻa ka paʻa pālua |
| Benzoxazine kaulahao nui | DFE149 | ʻO ka wai aniani melemele ʻeleʻele | - | ≤ 3 | 80-160 | <2000 Mpa·s | 70 土 2 | Tg: 215#C, Td5%: 380°C, Dk: 2.87, Df：0.0074 (10GHz) |
| ʻO ka ʻano DCPD Benzoxazine | DFE150 | ʻulaʻula ʻulaʻula ʻeleʻele wai | - | ≤ 3 | 2000-2500 | <1000 Mpa·s | 75±2 | Dk: 2.85, Df: 0.0073 (10GHz) |
| ʻO Bisphenol benzoxazine | DFE153 | ʻO ka wai aniani melemele ʻeleʻele | 一 | ≤ 3 | 100-200 | <2000 Mpa·s | 70±2 | Dk: 2.88, Df: 0.0076 (10GHz) , |
Bisphenol He moʻo epoxy resin
ʻO Bisphenol A epoxy resin o kā mākou hui e komo i ka wai epoxy resin, solid epoxy resin a me ka solvent epoxy resin, nona ka hydrolysis chlorine haʻahaʻa a hoʻohana nui ʻia i nā uhi, nā mea uila, nā mea hoʻohui a me nā māla ʻē aʻe.
| Inoa | Papa No | EEW (g/eq) | kalakala (G) | ʻO ka viscosity (mPa.s) | Hy-Cl (ppm) |
| Liquid bisphenol He resin epoxy | DFE1126 | 165-175 | ≤0.5 | 3000-5000 | <200 |
| DFE1127 | 180-190 | ≤1 | 8000-11000 | <500 | |
| DFE1128 | 184-194 | ≤1 | 12000-15000 | <500 | |
| DFE1128H | 184-194 | ≤1 | 12000-15000 | <100 | |
| Inoa | Papa No | EEW(g/eq) | kalakala (G) | Lahi hooluolu (℃) | |
| Bisphenol paʻa A epoxy resin | DFE1011 | 450-500 | ≤1 | 60-70 | |
| DFE1901 | 450-500 | ≤1 | 65-75 | ||
| Inoa | Papa No | EEW (g/eq) | kalakala (G) | ʻO ka viscosity (mPa.s) | NV (%) |
| ʻAno hoʻonā wai bisphenol A epoxy resin | DFE1901EK70 | 450-500 | ≤1 | 2000-5000 | 70±1 |
Bisphenol F epoxy resin moʻo
Loaʻa i ka Bisphenol F epoxy resin nā hiʻohiʻona o ka viscosity haʻahaʻa, ka wai maikaʻi a me ka pulu, a ua loaʻa i kā mākou hui kahi ʻenehana hana bisphenol F kūʻokoʻa me nā lako maka. Hoʻohana nui ʻia nā huahana i nā mea hoʻoheheʻe ʻole, ka hoʻolei ʻana, nā adhesives, nā mea insulation a me nā māla ʻē aʻe.
| Inoa | Papa No | EEW (g/eq) | ʻO ka viscosity (mPa·s) | kalakala (G) | Hy-Cl (ppm) |
| Liquid bisphenol F epoxy resin | DFE1160 | 155-165 | ≤1600 | ≤1 | ≤100 |
| DFE1170L | 165-175 | 2900-3500 | ≤1 | ≤100 | |
| DFE1170 | 165-175 | 3500-4500 | ≤1 | ≤100 | |
| DFE1170H | 165-175 | 5000-6000 | ≤1 | ≤100 | |
| DFE1170K | 165-175 | 5000-6000 | ≤1 | ≤200 | |
| Inoa | Papa No | EEW (g/eq) | kalakala (G) | Lahi hooluolu (℃) | |
| Bisphenol F epoxy resin paʻa | DFE1701 | 450-500 | ≤1 | 45-55 | |
| DFE1702 | 600-700 | ≤1 | 75-85 | ||
| DFE1703 | 700-800 | ≤1 | 85-95 | ||
| DFE1704D | 900-1000 | ≤1 | 90-100 | ||
| DFE1707D | 1300-1700 | ≤1 | 100-110 | ||
Phenolic epoxy resin moʻo
ʻO kā mākou phenolic epoxy resins he ʻano PNE, ʻano BNE a me ke ʻano CNE. ʻO kā lākou huahana i ho'ōla ʻia he kiʻekiʻe crosslinking density, ka ikaika hoʻopaʻa maikaʻi loa, ka pale wela a me ka pale kemika. Hoʻohana nui ʻia lākou i nā laminates uila keleawe, nā laminates uila, nā mea hoʻopili wela, nā composites, nā uhi wela kiʻekiʻe, nā ʻenekinia kīwila a me nā inika uila.
| Inoa | Papa No | EEW (g/eq) | wahi palupalu (°C) | kalakala (G) | Hy-Cl (ppm) |
| PNE ʻano phenolic epoxy resin | DFE1638 | 171-180 | 36-40 | ≤0.5 | ≤200 |
| DFE1638S | 171-179 | 36-40 | ≤0.5 | ≤200 | |
| DFE1636 | 170-178 | 27-31 | <1 | <300 | |
| DFE1637 | 170-178 | 31-36 | <1 | <300 | |
| DFE1639 | 174-180 | 44-50 | <1 | <300 | |
| DFE1625 | 168-178 | 9000-13000mpa·s | ≤1 | <300 | |
| BNE ano phenolic epoxy resin | DFE1200 | 200-220 | 60-70 | <3 | <500 |
| DFE1200H | 205-225 | 70-80 | <3 | <500 | |
| DFE1200HH | 210-230 | 80-90 | <3 | <500 | |
| CNE ano phenolic epoxy resin | DFE1701 | 196-206 | 65-70 | <2 | <500 |
| DFE1702 | 197-207 | 70-76 | <2 | <500 | |
| DFE1704 | 200-215 | 88-93 | <2 | <1000 | |
| DFE1704M | 200-215 | 83-88 | <2 | <1000 | |
| DFE1704ML | 200-210 | 80-85 | <2 | <1000 | |
| DFE1704L | 207-215 | 78-83 | <2 | <1000 | |
| Inoa | Papa No | EEW (g/eq) | ʻO ka viscosity (mPa.s) | NV (%) | |
| ʻAno hoʻonā ʻano phenolic epoxy resin | DFE236 | 200-220 | 1000-4000 | 80±1 | |
| DFE238 | 170-190 | 200-500 | 80 土 1 | ||
ʻO ka Phosphorus i loaʻa i ka epoxy resin series
ʻO nā resins epoxy me ka Phosphorus ka nui o nā ʻano ʻekolu, ʻo ia hoʻi ke ʻano DOPO, DOPO-HQtype a me DOPO-NQtype. He mea maikaʻi loa lākou i ka lapalapa ahi a me ka pale wela, a he haʻahaʻa ka wai absorption a me ka hoʻonui coefficient. No lākou i ka halogen-free flame retardant epoxy resin, a kūlike i ka RoHS a me WEEE Directive.
| Inoa | Papa No | Ka nana aku | NV (%) | EEW (g/eq) | ʻO ka viscosity (mPa.s) | P% (%) |
| DOPO-HQ hoʻololi phenolic epoxy resin | DFE200 | ʻulaʻula ʻulaʻula ʻeleʻele wai | 70±1.0 | 320 ±20 | <1000 | 2.0±0.1 |
| DOPO-HQ hoʻololi phenolic epoxy resin | DFE200A | ʻulaʻula ʻulaʻula ʻeleʻele wai | 70±1.0 | 275 ±25 | <1000 | 1.0±0.1 |
| DOPO-HQ hoʻololi phenolic epoxy resin | DFE200C | ʻO ka wai aniani melemele | 80±1.0 | 255 ±15 | 1000-7000 | 2.0±0.1 |
| DOPO-HQ hoʻololi phenolic epoxy resin | DFE200D | ʻO ka wai aniani melemele | 80±1.0 | 230±20 | 1000-4000 | 1.0±0.1 |
| DOPO-NQ hoʻololi phenolic epoxy resin | DFE201 | ʻulaʻula ʻulaʻula ʻeleʻele wai | 75±1.0 | 330±30 | 1000-3000 | 2.5 ±0.1 |
| DOPO-NQ hoʻololi phenolic epoxy resin | DFE201A | ʻulaʻula ʻulaʻula ʻeleʻele wai | 75±1.0 | 330 土 10 | 1500-1700 | 2.5 ±0.1 |
| DOPO hoʻololi i ka phenolic epoxy resin | DFE202 | ʻAʻole waihoʻoluʻu i ka wai aniani melemele māmā | 75 ±1.0 | 315±20 | 1000-3000 | 3.1 〜3.2 |
| DOPO hoʻololi i ka phenolic epoxy resin | DFE202A | ʻulaʻula ʻulaʻula ʻeleʻele wai | 70 ±1.0 | 300±20 | <2000 | 2.4±0.1 |
| DOPO hoʻololi i ka phenolic epoxy resin | DFE202B | ʻAʻole waihoʻoluʻu i ka wai aniani melemele māmā | 75±1.0 | 310±20 | ≤3000 | 2.8 〜3.2 |
| DOPO hoʻololi i ka phenolic epoxy resin | DFE202C | ʻO ka wai maʻemaʻe a maopopo | 75±1.0 | 300±20 | <3000 | 3.1 ±0.1 |
| DOPO hoʻololi i ka phenolic epoxy resin | DFE202D | ʻO ka wai aniani melemele māmā | 70±1.0 | 360 土 30 | ≤ 1500 | 2.5 ±0.2 |
Brominated epoxy resin moʻo
ʻO nā epoxy resins brominated he ʻano mea halogen flame retardant epoxy resins. Hoʻokumu kā mākou hui i ka bromine kiʻekiʻe a me ka bromine haʻahaʻa epoxy resin, nona ka permeability maikaʻi i ka lole aniani, ka pale ahi maikaʻi a me ka pale wela, a hoʻohana nui ʻia i ke kula o ka non halogen flame retardant copper clad laminate.
| Inoa | Papa No | Ka nana aku | NV (%) | EEW (g/eq) | ʻO ka viscosity (mPa.s) | Br% (%) |
| haʻahaʻa bromine maʻiʻo epoxy resin | DFE271 | ʻEleʻele melemele a ʻulaʻula ʻulaʻula wai aniani | 80±1.0 | 250-280 | 200-800 | 11.5±1.0 |
| DFE274 | ʻEleʻele melemele a ʻulaʻula ʻulaʻula wai aniani | 75±1.0 | 280-320 | 200-1500 | 18-21 | |
| DFE276 | ʻEleʻele melemele a ʻulaʻula ʻulaʻula wai aniani | 75 土 1.0 | 340-380 | 200-400 | 18-21 | |
| DFE277 | ʻEleʻele melemele a ʻulaʻula ʻulaʻula wai aniani | 80±1.0 | 410-440 | 800-1800 | 18-21 | |
| DFE278 | ʻulaʻula ʻulaʻula ʻeleʻele wai | 80±1.0 | 410-440 | 800-1800 | 18-21 | |
| Inoa | Papa No | Ka nana aku | EEW (g/eq) | hooluolu kiko (°C) | Br% (%) | |
| kiʻekiʻe bromine maʻiʻo epoxy resin | DFE270 | Paʻa kala ʻole a melemele | 380-420 | 67-74 | 46-50 | |
MDI hoʻololi epoxy resin moʻo
ʻO ka MDI epoxy resin i hoʻololiʻia he epoxy i hoʻololiʻia e Isocyanate me ka oxazolidinone i hoʻokomoʻia i loko o ke kaulahao nui, a he maikaʻi ke kūpaʻa wela a me ka maʻalahi. Loaʻa ka huahana i loko o Boron manuahi a me Boron i loaʻa, He mea hiki ke hoʻoheheʻe ʻia i nā solvents maʻamau e like me propylene glycol methyl ether, acetone, butanone, etc.
| Inoa | Papa No | Ka nana aku | NV (%) | EEW (g/eq) | ʻO ka viscosity (mPa.s) | Br% (%) |
| MDI hoʻololi i ka brominated epoxy resin | DFE204 | ʻulaʻula ʻulaʻula ʻeleʻele wai | 75±1.0 | 330-370 | 500-2000 | 16.5-18 |
| DFE204A | ʻulaʻula ʻulaʻula ʻeleʻele wai | 75±1.0 | 330-370 | 500-2000 | 16.5-18 | |
| MDI hoʻololi epoxy resin | DFE205 | ʻO ka wai aniani ʻeleʻele melemele | 75 ±1.0 | 250-310 | 500-2500 | - |
| DFE205A | ʻO ka wai aniani ʻeleʻele melemele | 75 ±1.0 | 270-330 | 500-2500 | - |
Macromolecular epoxy resin moʻo
ʻO nā resins epoxy Macromolecular kahi ʻano o ka bisphenol A / F epoxy resins i hoʻololi ʻia, aia nā ʻiʻo flexible molecular skeletons a me nā ʻāpana kaulahao lōʻihi, a loaʻa ka maʻalahi a me ka adhesion. He kūpono ia no ka papa kaapuni i pai ʻia, ka laminate copper copper clad, adhesive, composite material, uila laminate a me nā huahana ʻē aʻe.
| Inoa | Papa No | Ka nana aku | NV (%) | EEW (g/eq) | ʻO ka viscosity (mPa.s) |
| ʻO ka bisphenol i hoʻololi ʻia A resin epoxy | DFE206 | ʻAʻole waihoʻoluʻu i ka wai aniani melemele māmā | 75 土 1.0 | 470±30 | 500-3000 |
| Hoʻololi ʻia ka bisphenol Fepoxy resin | DFE207 | Melemele māmā a ʻulaʻula ʻulaʻula ka wai aniani | 70±1.0 | 550 ±50 | 500-3000 |
DCPD epoxy resin moʻo
ʻO DCPD epoxy resin kahi ʻano linear multifunctional epoxy resin me Dk / DF haʻahaʻa, kūpaʻa wela maikaʻi, haʻahaʻa haʻahaʻa, adhesion kiʻekiʻe a me ke kūpaʻa kemika. Hoʻohana nui ʻia ia i ke alapine kiʻekiʻe a me ke kiʻekiʻe kiʻekiʻe o ka laminate copper clad, nā mea hoʻoheheʻe ʻia, nā uhi pale ahi, nā mea hoʻopili ahi a me nā māla ʻē aʻe.
| Inoa | Papa No | EEW (g/eq) | wahi palupalu (°C) | Hy-Cl (ppm) |
| Paʻa DCPD epoxy resin | DFE211LL | 260-275 | 53-60 | <300 |
| DFE211L | 265-275 | 60-70 | <300 | |
| DFE211 | 260-280 | 70-80 | <300 | |
| DFE211H | 260-280 | 80-90 | <300 | |
| DFE211HH | 265-285 | 90-100 | <300 | |
| Inoa | Papa No | EEW (g/eq) | NV (%) | ʻO ka viscosity (mPa.s) |
| DCPD epoxy resin solution | DFE210 | 260-280 | 75±1 | 200-800 |
Nā moʻo epoxy resin multifunctional
ʻO ka resin epoxy multifunctional he ʻano epoxy resin me ʻekolu a ʻehā paha degere hana. Loaʻa iā ia nā hiʻohiʻona o ke kiʻekiʻe cross-linking density, maikaʻi ke kūpaʻa wela, ka hoʻōla wikiwiki, ka ikaika kiʻekiʻe a me ke kūpaʻa kemika maikaʻi loa. Hoʻohana nui ʻia ia i nā kula o ka laminate copper clad laminate a me nā mea hoʻohui.
DFE250
DFE254
DFE256
DFE258
| Inoa | Papa No | EEW (g/eq) | kalakala (G) | Hy-Cl (ppm) |
| ʻO ka resin epoxy Tetrafiinctional | DFE250 | 195-230 | ≤18 | - |
| Kiʻekiʻe wela epoxy resin multifunctional | DFE254 | 110-120 | <11 | <1000 |
| DFE256 | 90-110 | <11 | <1000 | |
| ʻO ka resin epoxy trifunctional | DFE258 | 155-175 | <18 | <1000 |
| Inoa | Papa No | EEW (g/eq) | NV (%) | ʻO ka viscosity (mPa.s) |
| ʻO ka hopena epoxy resin Tetrafunctional | DFE251 | 200-240 | 70 士 1 | 50-250 |
ʻO ka moʻo ʻeleʻele epoxy resin kristal/wai
ʻO ka Crystalline (ke aniani wai) epoxy resin nā hiʻohiʻona o ka viscosity haʻahaʻa, ke kūpaʻa wela, ka wai kiʻekiʻe, ka haʻahaʻa haʻahaʻa o ka hoʻonui laina a me ka haʻahaʻa wai haʻahaʻa, i hoʻohana nui ʻia i ka laminate copper copper clad, composite material a me nā māla ʻē aʻe.
DFE260
DFE261
DFE262
DFE264
| Inoa | Papa No | EEW (g/eq) | wahi hehee / palupalu (°C) | Hy-Cl (ppm) | waiwai |
| Biphenyl phenolic epoxy resin | DFE260 | 280-300 | 65-75 | <300 | Dielectric haʻahaʻa, pale wela kiʻekiʻe |
| Biphenyl Liquid Crystalline Epoxy resin | DFE261 | 184-192 | >100 | <300 | Haʻahaʻa viscosity, kiʻekiʻe thermal conductivity |
| BHQBiphenyl Crystalline Epoxy resin | DFE262 | 168-180 | >136 | <300 | Haʻahaʻa viscosity, pale ahi |
| Tetramethylbisphenol F epoxy resin | DFE264 | 190-210 | >69 | <300 | Haʻahaʻa viscosity, haʻahaʻa dielectric |
Phenol Formaldehyde Resin moʻo
ʻO ka resin phenolic linear he resin phenolic maikaʻi a maʻemaʻe hoʻi i hoʻomohala ʻia no ka ʻoihana uila. Hōʻike ʻia ia e ka waihoʻoluʻu māmā, ka hāʻawi ʻana i ke kaumaha molecular haʻahaʻa a me ka haʻahaʻa haʻahaʻa haʻahaʻa haʻahaʻa (hiki ke hoʻemi ʻia ka haʻahaʻa i l00ppm). Hoʻohana nui ʻia ia i ka laminate copper clad laminate, semiconductor packaging a me nā māla ʻē aʻe. Eia kekahi, i ka hāʻawi ʻana i nā mea kūʻai aku i nā huahana palupalu kikoʻī, hiki i kā mākou hui ke hāʻawi pū i ka resin butanone solution me ka ʻike paʻa o 60% - 70% e like me ke koi.
| Inoa | Papa No | Ka nana aku | hooluolu kiko (°C) | Phenol manuahi (%) | Maʻiʻo Volatile ʻAʻole (%) | like hydroxyl (g/eq) |
| Phenol Formaldehyde Resin | DFE308 | ʻAʻole waihoʻoluʻu a hiki i ka melemele māmā paʻa | 84 土 3 | <0.05 | ≥ 99.5 | 106±2 |
| DFE309 | 95±3 | <0.05 | ≥ 99.5 | 106±2 | ||
| DFE310 DFE311 | 98±3 | ≤0.1 | ≥ 99.5 | 106±3 | ||
| 105 ±3 | ≤0.1 | ≥99.5 | 106±3 | |||
| DFE312 | 115±3 | ≤0.1 | ≥99.5 | 106±3 | ||
| BP He ʻano phenolic resin | DFE322 | Melemele a ʻulaʻula ʻulaʻula paʻa | 122 ±3 | ≤0.1 | ≥99.5 | 118±3 |
ʻO ka Phosphorus i loaʻa ka phenolic resin series
ʻO ka phosphorus i loaʻa ka phenolic resin he kiʻekiʻe ka phosphorus maʻiʻo a me ka maikaʻi o ka lapalapa ahi, hiki ke hana i ka hemahema o ka haʻahaʻa haʻahaʻa phosphorus i loko o ka phosphorus i loko o ka epoxy resin. He kūpono ia no ka laminate copper copper clad, capacitor packaging, electrical laminate a me nā māla ʻē aʻe.
| Inoa | Papa No | Ka nana aku | NV (%) | P% (%) | ʻO ka viscosity (cps) | like hydroxyl (g/eq) | waiwai |
| ʻO ka phosphorus e hoʻohaumia i ka resin phenolic | DFE392 | ʻO ka wai aniani melemele | 60 ±1.0 | 8.9 〜9.2 | 400—3000 | 360〜400 | Hoʻopaʻa ahi maikaʻi |
| DFE394 | ʻO ka wai aniani melemele | 60 ±1.0 | 8.9 〜9.2 | 3000〜5000 | 320〜360 | ʻO ka hana kiʻekiʻe a me ka pale ahi | |
| DFE395 | ʻO ka wai aniani melemele | 56±1,0 | 8.9 〜9.2 | 1000〜4000 | 320〜360 | ʻO ka hana kiʻekiʻe a me ka pale ahi | |
| D992-2 | Melemele a ʻeleʻele mālohi | 60 ±1,0 | 8,6 〜8.8 | 400—3000 | 320〜360 | ʻO ke kumu kūʻai haʻahaʻa, maikaʻi ka pale ahi | |
| D994 | ʻO ka wai aniani melemele | 60 ±1,0 | 8.9 〜9.2 | 400〜3000 | 320〜360 | ʻO ka hana kiʻekiʻe a me ka pale ahi |
ʻO ka moʻo resin hydrocarbon i hoʻololi ʻia
He ʻano koʻikoʻi ʻo Hydrocarbon resin series i ka resin substrate circuit circuit ma 5g kahua. Ma muli o kāna hana kemika kūikawā, maʻamau he dielectric haʻahaʻa, kūpaʻa wela maikaʻi a me ke kūpaʻa kemika. Hoʻohana nui ʻia ia i ka 5g copper clad laminates, laminates, flame retardant material, high temperature resistant insulating paint, adhesives and casting materials. Loaʻa nā huahana i ka resin hydrocarbon i hoʻololi ʻia a me ka haku mele hydrocarbon resin.
ʻO ka resin hydrocarbon i hoʻololi ʻia he ʻano hydrocarbon resin i loaʻa e kā mākou hui ma o ka hoʻololi ʻana i nā mea waiwai hydrocarbon. Loaʻa iā ia nā waiwai dielectric maikaʻi, ʻike vinyl kiʻekiʻe, ikaika peel kiʻekiʻe, a me nā mea ʻē aʻe, a hoʻohana nui ʻia i nā mea kiʻekiʻe.
| Inoa | Papa No | Ka nana aku | NV (%) | ʻO ka viscosity (mPa.s) | waiwai |
| Hoʻololi ʻia ka styrene butadiene resin | DFE401 | Wai melemele māmā | 35±2.0 | <3000 | ʻO ke kaumaha molekala kiʻekiʻe a me ka dielectric haʻahaʻa. Hoʻohana nui ʻia i ka resin hydrocarbon, polyphenylene ether a me ka ʻōnaehana resin peek |
| Epoxy resin i hoʻololi ʻia i ka styrene butadiene resin | DFE402 | Wai waihoʻoluʻu a melemele | 60±2.0 | <5000 | ʻO ka epoxy i hoʻololi ʻia e Anhydride me nā waiwai dielectric haʻahaʻa hoʻohana nui ʻia i nā mea kiʻekiʻe-wikiwiki |
| Styrene butadiene resin me nā waiwai dielectric haʻahaʻa | DFE403 | 60±2.0 | <2000 | ʻIke vinyl kiʻekiʻe, kiʻekiʻe crosslinking density, hoʻohana nui ʻia i ka resin hydrocarbon, polyphenylene ether a me ka ʻōnaehana resin peek | |
| ʻO ka resin hydrocarbon i hoʻololi ʻia | DFE404 | 40+2.0 | <2000 | Haʻahaʻa dielectric, haʻahaʻa wai absorption, kiʻekiʻe peel ikaika | |
| Hoʻololi ʻia ka polystyrene resin | DFE405 | 60 土 2.0 | <3000 | ʻIke vinyl kiʻekiʻe, kiʻekiʻe crosslinking density, hoʻohana nui ʻia i ka resin hydrocarbon, polyphenylene ether a me ka ʻōnaehana resin peek | |
| ʻO ka resin hydrocarbon i hoʻololi ʻia | DFE406 | 35±2.0 | <2000 | Haʻahaʻa wai absorption, kiʻekiʻe peel ikaika, maikaʻi dielectric waiwai | |
| resina hydrocarbon | DFE412 | Wai melemele māmā | 50 土 2.0 | <8000 | Modulus kiʻekiʻe, kaumaha molekala kiʻekiʻe a me ka dielectric haʻahaʻa |
| ʻO resin paʻa pālua me nā waiwai dielectric haʻahaʻa | DFE416 | Wai waihoʻoluʻu a melemele | 60+2.0 | <2000 | ʻIke vinyl kiʻekiʻe, kiʻekiʻe crosslinking density, hoʻohana nui ʻia i ka resin hydrocarbon, polyphenylene ether a me ka ʻōnaehana resin peek |
ʻO ka pūʻulu haku mele hydrocarbon resin
ʻO ka hydrocarbon resin composite kahi ʻano o ka hydrocarbon resin composite i hoʻomohala ʻia e kā mākou hui no 5g kamaʻilio. Ma hope o ke kuʻi ʻana, hoʻomaloʻo, laminating a me ke kaomi ʻana, loaʻa i ka composite nā waiwai dielectric maikaʻi loa, ka ikaika peel kiʻekiʻe, ke kūpaʻa wela maikaʻi a me ka retardancy ahi maikaʻi. Hoʻohana nui ʻia ia ma 5g base station, antenna, power amplifier, radar a me nā mea kiʻekiʻe kiʻekiʻe.carbon resin i loaʻa e kā mākou hui ma o ka hoʻololi ʻana i nā mea waiwai hydrocarbon. Loaʻa iā ia nā waiwai dielectric maikaʻi, ʻike vinyl kiʻekiʻe, ikaika peel kiʻekiʻe, a me nā mea ʻē aʻe, a hoʻohana nui ʻia i nā mea kiʻekiʻe.
| Inoa | Papa No | Ka nana aku | NV (%) | waiwai |
| ʻO ka hoʻohui ʻana i ka resin hydrocarbon | DFE407 | He wai keʻokeʻo a melemele | 65 ±2.0 | Dk/Df: 3.48/0.0037 Hoʻohana nui ʻia i ka mana hoʻonui (V0) |
| DFE407A | 65 ±2.0 | Dk: 3.52 High fluidity, hoʻohana nui ʻia i ka hana ʻana o ka adhesive pepa | ||
| DFE408 | 65 ±2.0 | Dk/Df: 3.00/0.0027 Hoʻohana nui ʻia ma ke kahua kahua a me ka antenna (papa multilayer, flame retardant V0) | ||
| DFE408A | 65 ±2.0 | Dk: 3.00 High fluidity, hoʻohana nui ʻia i ka hana ʻana o ka adhesive pepa | ||
| DFE409 | 65 ±2.0 | Dk/Df: 3.30/0.0027 Hoʻohana nui ʻia i ka antenna (papa ʻelua ʻaoʻao, non flame retardant V0) | ||
| DFE410 | 65 ±2.0 | Dk/Df: 3.40/0.0029 Hoʻohana nui ʻia i ka antenna (papa ʻelua ʻaoʻao, non flame retardant V0) | ||
| DFE411 | 65 土 2.0 | Dk/Df: 3.38/0.0027 Hoʻohana nui ʻia i ka mana amplifier (non flame retardant) |
Ester ʻeleu
Hoʻopili ʻo ia i ka mea hoʻōla ester ikaika me ka resin epoxy e hana i ka pahu me ka ʻole o ka hui hydroxyl waiʻona lua. Loaʻa i ka ʻōnaehana hoʻōla nā hiʻohiʻona o ka haʻahaʻa wai haʻahaʻa a me Dk / Df haʻahaʻa.
| Inoa | Papa No | helehelena | Ester like | NV (%) | Viscosity (卬s) | wahi palupalu rc) |
| Mea ho'ola ester ha'aha'a dielectric | DFE607 | ʻO ka wai viscous ʻeleʻele māmā | 230〜240 | 69 ±1.0 | 1400〜1800 | 140〜150 |
| DFE608 | wai ʻulaʻula ʻulaʻula | 275-290 | 69±1.0 Loaʻa nā paʻa | 800-1200 | 140-150 | |
| DFE609 | wai ʻulaʻula | 275-290 | 130-140 | |||
| DFE610 | wai ʻulaʻula | 275-290 | 100-110 |
Monomer Resin Kūikawā
ʻOi aku ka nui o ka phosphorus ma mua o 13%, ʻoi aku ka nui o ka nitrogen ma mua o 6%, a maikaʻi ke kūpaʻa hydrolysis. He kūpono ia no ka laminate copper copper clad, capacitor packaging a me nā māla ʻē aʻe.
ʻO ka BIS-DOPO ethane kahi ʻano o nā mea hoʻohuihui phosphate, ʻaʻohe halogen-free environmental flame retardant. ʻO ka huahana he pauda keʻokeʻo paʻa. He maikaʻi loa ka paʻa wela a me ka paʻa kemika, a ʻoi aku ka mahana o ka decomposition ma luna o 400 °C. ʻO kēia huahana he mea hiki ke pale i ke ahi a me ke kaiapuni. Hiki iā ia ke hoʻokō piha i nā koi kaiapuni o ka European Union. Hiki ke hoʻohana ʻia ma ke ʻano he pale ahi ma ke kahua o ka laminate ʻaʻahu keleawe. Eia kekahi, ʻoi aku ka maikaʻi o ka huahana me ka polyester a me ka nylon, no laila he maikaʻi loa ka spinnability i ke kaʻina wili, maikaʻi ka wili mau a me nā waiwai kala, a hoʻohana nui ʻia i ke kula o ka polyester a me ka nylon.
| Inoa | Papa No | Ka nana aku | hehee ana kiko (℃） | P% % | N% (%) | Td5%（℃） | Waiwai |
| ʻO Phosphazene ka pale ahi | DFE790 | Pauka lepo keʻokeʻo a melemele paha | 108 ±4.0 | ≥13 | ≥6 | ≥320 | ʻO nā mea phosphoms kiʻekiʻe, ka pale ahi, ke kūpaʻa wela kiʻekiʻe, ke kūpaʻa hydrolysis, kūpono no ka laminate ʻaʻahu keleawe a me nā māla ʻē aʻe. |
| Inoa | Papa No | Ka nana aku | maʻiʻo % | hehee ana kiko CC) | P% % | Td2% V | Waiwai |
| BIS-DOPO etana | DFE791 | Pauda keʻokeʻo | ≥99 | 290-295 | ≥13 | ≥400 | Maʻiʻo ion Chloride< 20ppm, wahi hehee kiʻekiʻe, mānoanoa pohā kiʻekiʻe, haʻahaʻa e^ansion coefficient |
Maleimide Resin moʻo
ʻO DFE930n DFE936> DFE937, DFE939 ^ DFE950 a me DFE952 he mau resins maleimide uila me ka maʻemaʻe kiʻekiʻe, ka liʻiliʻi o nā haumia a me ka solubility maikaʻi. Ma muli o ke ʻano o ke apo imine i loko o ka mole, he ikaika ko lākou rigidity a me ke kūpaʻa wela maikaʻi. Hoʻohana nui ʻia lākou i nā mea aerospace structural ， carbon fiber kiʻekiʻe ka wela resistant structural parts ， kiʻekiʻe wela wela impregnating pena, laminates, copper clad laminates, molded plastics, etc.
| Inoa | Papa NO | Ka nana aku | hehee kiko (℃) | Waiwai ʻakika ( mg KOH/g) | Huʻihuʻi maʻiʻo (%) | (5mm) Hoʻoheheʻe ʻia o toluene wela (5min) | Waiwai |
| Bismaleimide papa uila | DFE928 | Nā ʻāpana paʻa melemele | 158±2 | ≤3.0 | ≤0.3 | Hiki ke hoʻoheheʻe ʻia | Kūleʻa wela kiʻekiʻe |
| ʻO ka diphenylmethane Bismaleimide papa uila | DFE929 | Nā ʻāpana paʻa melemele māmā | 162 ±2 | ≤1.0 | ≤0.3 | ʻO ka maʻemaʻe kiʻekiʻe a me ka waiwai haʻahaʻa o ka waikawa | |
| Bismaleimide papa uila | DFE930 | ʻO ka pauka keʻokeʻo melemele māmā | 160 ±2 | ≤1.0 | ≤0.3 | Maʻemaʻe kiʻekiʻe aad haʻahaʻa acid^lue | |
| Bismaleimide kristal haʻahaʻa | DFE936 | 168 ±2 | ≤1.0 | ≤0.3 | Hoʻoheheʻe maikaʻi | ||
| Haʻahaʻa crystalline a haʻahaʻa dielectric Bismaleimide | DFE937 | 168 ±2 | ≤1.0 | ≤0.3 | Hoʻoheheʻe maikaʻi | ||
| Phenyl bismaleimide me ka helu heheʻe haʻahaʻa | DFE939 | Paʻa ʻeleʻele māmā a i ʻole ka pauka paʻa melemele | 50 土 10 | ≤3.0 | ≤0.3 | Hoʻoheheʻe maikaʻi | |
| polymaleimide wahi hoohehee haahaa | DFE950 | 50 ±10 | ≤3.0 | ≤0.3 | Hoʻoheheʻe maikaʻi | ||
| Tetramaleirnide wahi meltmg haʻahaʻa | DFE952 | 50 ±10 | ≤3.0 | ≤0.3 | Hoʻoheheʻe maikaʻi |
"Ma muli o ka mākeke kūloko a me ka hoʻonui ʻana i nā ʻoihana ʻē aʻe" ʻo kā mākou papahana hoʻomohala no China Factory no Kina CNMI Epoxy Resin aniani akaka no ka uhi ʻana i ka liʻiliʻi liʻiliʻi liʻiliʻi o ka muliwai papaʻaina mea hoʻonaninani pā hale, hiki iā ʻoe ke loaʻa ke kumu kūʻai haʻahaʻa loa ma aneʻi. E loaʻa nō hoʻi iā ʻoe nā mea waiwai maikaʻi a me nā lawelawe maikaʻi ma aneʻi! E ʻoluʻolu, mai kali e hopu iā mākou!
Hale Hana Kina noKina Epoxy resin, resin epoxy ʻona ʻole, Me ke kumu o ka win-win, ke manaʻolana nei mākou e kōkua iā ʻoe e hoʻonui i ka loaʻa kālā ma ka mākeke. ʻAʻole e hopu ʻia kahi manawa, akā e hana ʻia. Hoʻokipa ʻia nā hui kālepa a i ʻole nā mea hoʻolaha mai kekahi ʻāina.
