| Nā Kūlana Kūwaena & Nā Kūlana Kūikawā Resin | ||||||||||||||||
| Māhele | Hoʻohālike | kalakala | Puka | HEW (g/eq) | Lae hehee (℃) | Lae Palupalu (℃) | Chromaticity (G/H) | Cone-Plate Viscosity (P) | Phenol manuahi (ppm) | Maemae (%) | Laʻana | Keʻano Packaging | Palapala noi | |||
| Nā mea waena | Phenolic Resin | ʻO Bisphenol A Phenolic Resin | EMTP322 | ʻAʻohe waihoʻoluʻu i ka Melemele-Brown | Paʻa | － | － | 114-119 | G≤0.8 | 60-90 | ≤2000 | － |  | ʻeke pepa me ka liner PE i loko: 25 kg / ʻeke. | Hoʻohana nui ʻia ka Epoxy resin intermediates a curing agents i nā laminates copper clad electronic, semiconductor packaging a me nā māla ʻē aʻe. | |
| Base Phenolic Resin | PF-2123 | Melemele ʻulaʻula a ʻulaʻula | 100-105 | G:12-14 | － | ≤4 |  | ʻeke pepa me ka liner PE i loko: 25 kg / ʻeke. ʻeke tona: 500kg / ʻeke | ʻO nā mea hoʻoheheʻe a me nā mea hoʻoheheʻe e like me nā pad brake no nā kaʻaahi, nā kaʻa a me nā kaʻa kaʻa, ka pauka bakelite no nā huahana uila, nā mea hoʻopili no nā ʻōpuʻu kukui, nā huila wili resin a me nā mea pale lole pale no ka wili ʻana a me ka ʻoki ʻana, ka hoʻoheheʻe ʻana i ke one adhesives, nā mea pale ahi, etc. | |||||||
| ortho-Cresol Phenolic Resin | EMTP210 | Melemele Māmā | 113-115 | G≤3 | 35-45 | <1000 | － | ʻeke pepa me ka liner PE i loko: 25 kg / ʻeke. | Hoʻohana nui ʻia ka Epoxy resin intermediates a curing agents i nā laminates copper clad electronic, semiconductor packaging a me nā māla ʻē aʻe. | |||||||
| TPN Tetraphenolethane Phenolic Resin | EMTP110 | Palaunu | 90-110 | 135-145 | G≤18 | － | ≤1000 | － | Epoxy resin waena a mea ho'ōla. | |||||||
| ʻO ka Bisphenol F | EMTP120 | Keʻokeʻo a ʻulaʻula | － | ≥105 | － | G＜0.8 | <1000 | ≥88 | － | ʻO nā mea waena e like me ka haʻahaʻa haʻahaʻa epoxy resins, polycarbonate resins, polyphenylene ether resins a unsaturated polyesters, a hiki ke hoʻohana ʻia e synthesize i nā mea pale ahi, antioxidants a me nā plasticizers. | ||||||
| DCPD Phenolic Resin | EMTP100 | ʻulaʻula ʻulaʻula | 150-210 | － | 100-110 | G≤13 | ≤1000 | － | － | ʻO ka laminate keleawe a me nā māla ʻē aʻe. | ||||||
| ʻO EMTD8700 Phosphazene Flame Retardant Technical Specifications | ||||||||||||||||
| Māhele | Hoʻohālike | kalakala | Puka | Lae hehee (℃) | Maʻiʻo paʻakikī (%) | Td5% (℃) | Maʻiʻo Phosphorus (%) | ʻIke Nitrogen (%) | Laʻana | Keʻano Packaging | Palapala noi | |||||
| ʻO Phosphazene ʻAi Paʻa Ke ahi | EMTD8700 | Keʻokeʻo Honua i ka Melemele Pale | Paʻa Pauda | 104-116 | ≤0.5 | ≥330 | ≥13 | ≥6 | － | ʻeke pepa me ka liner PE i loko: 25 kg / ʻeke. | ʻO nā laminates ʻaʻahu keleawe, ke kāpili uila uila, nā uhi hana, nā plastik pale ahi a me nā ʻoihana ʻē aʻe. | |||||
| ʻO nā kikoʻī kikoʻī ʻo Bismaleimide | ||||||||||||||||
| Māhele | Hoʻohālike | kalakala | Puka | Lae hehee (℃) | Waiwai ʻakika (mgKOH/g) | Ka hoʻoheheʻe | Laʻana | Keʻano Packaging | Palapala noi | |||||||
| Bismaleimide | Papa uila | EMTE505 | Mele Melemele | Paʻa Pauda | ≥155 | ≤1 | Paʻa Paʻa | － | Kiʻiʻoniʻoni i hoʻopaʻa ʻia i ka ʻeke pepa kraft composite a i ʻole ka pahu pahu pepa 25kg no ka ʻeke/barela. | Aerospace structural materials, carbon fiber high temperature resistant structural parts, high temperature resistant impregnation paint, laminates, copper clad laminates, molded plastics, high-grade printed circuit boards, wear-resistant materials, diamond grinding wheel adhesives, magnetic materials, castings and other functional materials and other high-tech fields. | ||||||
| Papa Uila | D929 | Pale Melemele-Keʻokeʻo | ≥155 | ≤1 | Paʻa Paʻa | － | ||||||||||
