| Nā Kikoʻī ʻenehana Resin Waena a me nā mea kūikawā | ||||||||||||||||
| Māhele | Hoʻohālike | Waihoʻoluʻu | Palapala | HEW (g/eq) | Kiko Heheʻe (℃) | Wahi Hoʻomālielie (℃) | Ka Chromaticity (G/H) | ʻO ka mānoanoa o ka papa kōne (P) | Phenol manuahi (ppm) | Maʻemaʻe (%) | Laʻana | ʻAno Hoʻopili | Noi | |||
| Nā Waena | ʻO ka Resin Phenolic | ʻO Bisphenol A ʻO ka Resin Phenolic | EMTP322 | ʻAʻohe kala a i ka melemele-ʻeleʻele | Paʻa | - | - | 114-119 | G≤0.8 | 60-90 | ≤2000 | - |  | ʻEke pepa me ka liner PE o loko: 25 kg / ʻeke. | Hoʻohana nui ʻia nā mea waena resin epoxy a i ʻole nā mea hoʻōla i nā laminates i uhi ʻia i ke keleawe uila, ka hoʻopili semiconductor a me nā kahua ʻē aʻe. | |
| Kumu ʻO ka Resin Phenolic | PF-2123 | Melemele Māmā a ʻUlaʻula ʻEleʻele | 100-105 | G:12-14 | - | ≤4 |  | ʻEke pepa me ka liner PE o loko: 25 kg/ʻeke. ʻEke tona: 500kg/ʻeke | Nā mea hoʻōki a me nā mea hoʻopākī e like me nā pale hoʻōki no nā kaʻaahi, nā kaʻa a me nā mokokaikala, ka pauka bakelite no nā huahana uila, nā mea hoʻopili no nā kukui uila, nā huila wili resin a me nā mea pale ʻaʻahu rapa no ka wili ʻana a me ka ʻoki ʻana, nā mea hoʻopili one hoʻoheheʻe, nā mea pale lapalapa, a pēlā aku. | |||||||
| ortho-Cresol ʻO ka Resin Phenolic | EMTP210 | Melemele Māmā | 113-115 | G≤3 | 35-45 | <1000 | - | ʻEke pepa me ka liner PE o loko: 25 kg / ʻeke. | Hoʻohana nui ʻia nā mea waena resin epoxy a i ʻole nā mea hoʻōla i nā laminates i uhi ʻia i ke keleawe uila, ka hoʻopili semiconductor a me nā kahua ʻē aʻe. | |||||||
| ʻO ka TPN Tetraphenolethane ʻO ka Resin Phenolic | EMTP110 | Palaunu | 90-110 | 135-145 | G≤18 | - | ≤1000 | - | Mea waena a mea hoʻōla paha o ka resin epoxy. | |||||||
| ʻO Bisphenol F | EMTP120 | Keʻokeʻo a ʻulaʻula ʻeleʻele | - | ≥105 | - | G<0.8 | <1000 | ≥88 | - | ʻO nā mea waena e like me nā resins epoxy haʻahaʻa viscosity, nā resins polycarbonate, nā resins polyphenylene ether a me nā polyesters unsaturated, a hiki ke hoʻohana ʻia e hana i nā mea pale ahi, antioxidants a me plasticizers. | ||||||
| DCPD ʻO ka Resin Phenolic | EMTP100 | ʻUlaʻula ʻeleʻele | 150-210 | - | 100-110 | G≤13 | ≤1000 | - | - | ʻO ka laminate i uhi ʻia i ke keleawe uila a me nā mahina ʻē aʻe. | ||||||
| Nā kikoʻī loea o ka EMTD8700 Phosphazene Flame Retardant | ||||||||||||||||
| Māhele | Hoʻohālike | Waihoʻoluʻu | Palapala | Kiko Heheʻe (℃) | ʻIkepili Lelelele (%) | Td5% (℃) | Ka nui o ka phosphorus (%) | Ka nui o ka naikokene (%) | Laʻana | ʻAno Hoʻopili | Noi | |||||
| Ka mea pale ahi Phosphazene | EMTD8700 | Keʻokeʻo Honua a Melemele Māmā | Paʻa Pauka | 104-116 | ≤0.5 | ≥330 | ≥13 | ≥6 | - | ʻEke pepa me ka liner PE o loko: 25 kg / ʻeke. | ʻO nā laminates i uhi ʻia i ke keleawe, ke kāpili ipu uila, nā uhi hana, nā plastics pale ahi a me nā ʻoihana ʻē aʻe. | |||||
| Nā Kikoʻī ʻenehana Bismaleimide | ||||||||||||||||
| Māhele | Hoʻohālike | Waihoʻoluʻu | Palapala | Kiko Heheʻe (℃) | Waiwai ʻakika (mgKOH/g) | Ka hiki ke hoʻoheheʻe ʻia | Laʻana | ʻAno Hoʻopili | Noi | |||||||
| ʻO Bismaleimide | Papa Uila | EMTE505 | Melemele Mālie | Paʻa Pauka | ≥155 | ≤1 | Hoʻoheheʻe piha ʻia | - | ʻEke pepa kraft composite i hoʻopaʻa ʻia i ka ʻili kiʻiʻoniʻoni a i ʻole ka ʻeke pahu pepa 25kg no kēlā me kēia ʻeke/barela. | Nā mea hana aerospace, nā ʻāpana hana kūpaʻa wela kiʻekiʻe o ke kalapona fiber, ka pena impregnation kūpaʻa wela kiʻekiʻe, nā laminates, nā laminates i uhi ʻia i ke keleawe, nā plastics i hoʻoheheʻe ʻia, nā papa kaapuni paʻi kiʻekiʻe, nā mea kūpaʻa ʻaʻahu, nā mea hoʻopili huila wili daimana, nā mea magnetic, nā hoʻolei a me nā mea hana ʻē aʻe a me nā kahua ʻenehana kiʻekiʻe ʻē aʻe. | ||||||
| Papa Uila | D929 | Pāpale Melemele-Keʻokeʻo | ≥155 | ≤1 | Hoʻoheheʻe piha ʻia | - | ||||||||||
