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Mea hoʻolako honua no ka mālama ʻana i ke kaiapuni

A me nā mea hou palekana palekana

MDI Hoʻololi Epoxy Resin

ʻO ka MDI epoxy resin i hoʻololiʻia he epoxy hoʻololi isocyanate me ka oxazolidinone i hoʻokomoʻia i loko o ke kaulahao nui, a he maikaʻi ke kūpaʻa wela a me ka maʻalahi. Loaʻa ka huahana ma Boron manuahi a me Boron i loko, hiki ke hoʻoheheʻe ʻia i nā solvents maʻamau e like me propylene glycol methyl ether, acetone, butanone, etc. He kūpono maikaʻi me ka dicyandiamide, phenolic curing agent, a he kūpono ia no ka halogen-free lead-free copper clad laminate field.


MDI Hoʻololi Epoxy Resin Nā kikoʻī kikoʻī Keʻano Packaging Palapala noi
  Hoʻohālike kalakala Puka Maikaʻi Paʻa
(%)
EEW
(g/eq)
Lae Palupalu
(℃)
Chromaticity
(G/H)
ʻO ka viscosity
(mPa·s)
Hydrolyzable Chlorine
(ppm)
Maʻiʻo Bromine
(%)
Maʻiʻo Phosphorus
(%)
Laʻana
MDI hoʻololi epoxy resin ʻO ka resin epoxy brominated i hoʻololi ʻia EMTE8204 Melemele a ʻulaʻula Waiwai 74-76 335-365 G:7-13 300-1000 16.5-18   Pahu hao: 220kg / pahu ʻO nā substrate papa kaapuni paʻi paʻi ʻia i ka lapalapa ahi, nā papa ʻaʻahu keleawe uila, ka puʻupuʻu capacitor, nā laminates uila a me nā wahi huahana ʻē aʻe.
EMTE8205 ʻAlaʻulaʻulaʻulaʻulaʻulaʻulaʻulaʻulaʻulaʻulaʻulaʻulaʻulaʻulaʻulaʻulaʻulaʻulaʻulaʻulaʻula a iʻole Melemele Melemele Paʻa 280-320 65-75 ʻeke pepa me ka liner PE i loko: 25 kg / ʻeke. ʻO nā substrate kaapuni i paʻi ʻia i ka lapalapa ahi ʻole halogen, nā laminates uila keleawe-ʻaʻahu ʻia, ka pahu capacitor, nā laminates uila a me nā wahi huahana ʻē aʻe.
EMTE
8205CK75
Melemele Brown a Red Brown Waiwai 74-76 280-320 G:8-12 500-2500 ≤500 Pahu hao: 220kg / pahu

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