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Mea hoʻolako honua no ka mālama ʻana i ke kaiapuni

A me ka Palekana Mea Hou

MDI Hoʻololi Epoxy Resin

ʻO ka MDI epoxy resin i hoʻololiʻia he epoxy hoʻololi isocyanate me ka oxazolidinone i hoʻokomoʻia i loko o ke kaulahao nui, a he maikaʻi ke kūpaʻa wela a me ka maʻalahi. Loaʻa ka huahana ma Boron manuahi a me Boron i loko, hiki ke hoʻoheheʻe ʻia i nā solvents maʻamau e like me propylene glycol methyl ether, acetone, butanone, etc. He kūpono maikaʻi me ka dicyandiamide, phenolic curing agent, a he kūpono ia no ka halogen-free lead-free copper clad laminate field.


ʻAno

ʻO Grage No.

Ahelehelena

NV

(%)

EEW

(g/eq)

ʻO ka viscosity

(mpa.s/25)

Br%

(%)

MDI hoʻololi i ka brominated epoxy resin

EMTE 8204-A75

ʻulaʻula ʻulaʻula ʻeleʻele wai

75±1.0

330~370

500~2000

16.5-18

MDI hoʻololi i ka brominated epoxy resin

EMTE 8204A-A75

ʻulaʻula ʻulaʻula ʻeleʻele wai

75±1.0

330~370

500~2000

16.5-18

MDI hoʻololi epoxy resin

EMTE 8205-M75

ʻO ka wai aniani ʻeleʻele melemele

75±1.0

250~310

500~2500

/

MDI hoʻololi epoxy resin

EMTE 8205A-M75

ʻO ka wai aniani ʻeleʻele melemele

75±1.0

270~330

500~2500

/

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