Mea Hoʻolako Honua no ka Palekana Kaiapuni

ʻO kā mākounā mea uila Ke nānā nui nei ka ʻoihana i nā resins, e hana nui ana i nā resins phenolic, nā resins epoxy kūikawā, a me nā resins uila no nā laminates keleawe-ʻūlū kiʻekiʻe a me ka wikiwiki (CCL).I nā makahiki i hala iho nei, me ka neʻe ʻana o ka CCL ma waho a me ka hiki ke hana PCB ma lalo i Kina, ua hoʻonui koke nā mea hana kūloko i ka hiki, a ua ulu koke ka nui o ka ʻoihana CCL kumu kūloko. Ke hoʻolalelale nei nā ʻoihana CCL kūloko i ka hoʻopukapuka kālā ma ka hiki ke hana huahana waena a kiʻekiʻe. Ua hana mākou i nā hoʻonohonoho mua i nā papahana no nā pūnaewele kamaʻilio, ka halihali kaʻaahi, nā pahi turbine makani, a me nā mea hui carbon fiber, e hoʻomohala ikaika ana i nā mea uila kiʻekiʻe a me ka wikiwiki no nā CCL. ʻO kēia mau mea me nā resins hydrocarbon, ka polyphenylene ether i hoʻololi ʻia (PPE), nā kiʻiʻoniʻoni PTFE, nā resins maleimide kūikawā, nā mea hoʻōla ester ikaika, a me nā mea pale ahi no nā noi 5G. Ua hoʻokumu mākou i nā pilina lako paʻa me kekahi mau mea hana CCL kaulana honua a me nā turbine makani. I ka manawa like, ke nānā pono nei mākou i ka hoʻomohala ʻana o ka ʻoihana AI. Ua hoʻohana ʻia kā mākou mau mea resin wikiwiki ma kahi nui ma nā kikowaena AI mai OpenAI a me Nvidia, e lawelawe ana ma ke ʻano he mau mea maka kumu no nā ʻāpana koʻikoʻi e like me nā kāleka accelerator OAM a me nā motherboards UBB.

Lawe nā noi kiʻekiʻe i kahi mahele nui, hoʻomau ka ikaika o ka hoʻonui ʻana o ka mana PCB

ʻO nā PCB, i ʻike ʻia ʻo "ka makuahine o nā huahana uila," hiki ke ulu hou. ʻO ka PCB kahi papa kaapuni i paʻi ʻia i hana ʻia me ka hoʻohana ʻana i nā ʻano hana paʻi uila e hana i nā pilina a me nā ʻāpana i paʻi ʻia ma kahi substrate maʻamau e like me kahi hoʻolālā i hoʻoholo mua ʻia. Hoʻohana nui ʻia ia i nā mea uila kamaʻilio, nā mea uila mea kūʻai aku, nā kamepiula, nā mea uila kaʻa ikehu hou, ka mana ʻoihana, nā mea lapaʻau, aerospace, a me nā ʻoihana ʻē aʻe.

ʻO nā CCL kiʻekiʻe-pinepine a me nā CCL wikiwiki nā mea nui no nā PCB hana kiʻekiʻe no nā kikowaena

ʻO nā CCL nā mea koʻikoʻi o luna e hoʻoholo ai i ka hana PCB, i haku ʻia me ka foil keleawe, ka lole aniani uila, nā resins, a me nā mea hoʻopihapiha. Ma ke ʻano he mea lawe nui o nā PCB, hāʻawi ka CCL i ka conductivity, ka insulation, a me ke kākoʻo mechanical, a ʻo kāna hana, ka maikaʻi, a me ke kumukūʻai e hoʻoholo nui ʻia e kāna mau mea maka o luna (foil keleawe, lole aniani, resins, silicon micropowder, a me nā mea ʻē aʻe). Hoʻokō nui ʻia nā koi hana like ʻole ma o nā waiwai o kēia mau mea o luna.

ʻO ke koi no nā CCL alapine kiʻekiʻe a me ka wikiwiki e alakaʻi ʻia e ka pono no nā PCB hana kiʻekiʻe.Hoʻokūpaʻa nā CCL wikiwiki kiʻekiʻe i ka pohō dielectric haʻahaʻa (Df), ʻoiai nā CCL alapine kiʻekiʻe, e hana ana ma luna o 5 GHz ma nā kikowaena alapine ultra-kiʻekiʻe, e kālele nui ana i nā constants dielectric ultra-low (Dk) a me ke kūpaʻa o Dk. ʻO ke ʻano o ka wikiwiki kiʻekiʻe, ka hana kiʻekiʻe, a me ka mana nui i nā kikowaena ua hoʻonui i ka noi no nā PCB alapine kiʻekiʻe a me ka wikiwiki, me ke kī i ka hoʻokō ʻana i kēia mau waiwai e waiho ana ma ka CCL.

Kiʻi: Hana nui ka resin ma ke ʻano he mea hoʻopiha no ka substrate laminate i uhi ʻia i ke keleawe.

Hoʻomohala Resin Kiʻekiʻe Proactive e Hoʻolalelale i ka Hoʻololi ʻana i ka Import

Ua kūkulu mua mākou i 3,700 tone o ka mana resin bismaleimide (BMI) a me 1,200 tone o ka mana ester hana. Ua hoʻokō mākou i nā holomua loea i nā mea maka koʻikoʻi no nā PCB alapine kiʻekiʻe a me ka wikiwiki, e like me ka resin BMI papa uila, ka resin hoʻōla ester hana haʻahaʻa-dielectric, a me ka resin polyphenylene ether thermosetting haʻahaʻa-dielectric (PPO), a ua hala nā loiloi a pau e nā mea kūʻai aku kaulana o loko a me waho.

Ke kūkulu ʻana i ka wikiwiki kiʻekiʻe he 20,000-tonNā Mea Uila Papahana

No ka hoʻonui hou ʻana i ka mana a me ka hoʻoikaika ʻana i ko mākou kūlana mākeke, hoʻonui i kā mākou waihona huahana, a ʻimi ikaika i nā noi o nā mea uila ma AI, nā kamaʻilio ukali haʻahaʻa, a me nā kahua ʻē aʻe, ʻo kā mākou lālā ʻo Meishan EMThoʻolālā e hoʻopukapuka kālā i ka "Hana Makahiki o 20,000 Tons o High-Speed ​​Communication Substrate Electronic Materials Project" ma Meishan City, Sichuan Province. Manaʻo ʻia ka huina kālā he RMB 700 miliona, me kahi manawa kūkulu o kahi 24 mau mahina. Ke holo pono ka hana, ua manaʻo ʻia ka papahana e loaʻa ka loaʻa kālā kūʻai makahiki ma kahi o RMB 2 biliona, me ka loaʻa kālā makahiki ma kahi o RMB 600 miliona. Ua manaʻo ʻia ka helu hoʻihoʻi kūloko ma hope o ka ʻauhau ma 40%, a ua manaʻo ʻia ka manawa uku hoʻopukapuka kālā ma hope o ka ʻauhau ma 4.8 mau makahiki (me ka wā kūkulu).