ʻO kā mākoumea uila ʻO ka ʻoihana e kālele ana i nā resins, ka hana mua ʻana i nā resins phenolic, nā resins epoxy kūikawā, a me nā resins uila no nā laminates copper-clad (CCL) kiʻekiʻe a me ka wikiwiki.I kēia mau makahiki i hala iho nei, me ka hoʻololi ʻana o ka mana o ka CCL i waho a me ka PCB i lalo i Kina, ua hoʻonui wikiwiki nā mea hana hale, a ua ulu wikiwiki ka nui o ka ʻoihana CCL kumu. Ke hoʻoikaika nei nā hui CCL kūloko i ka hoʻokomo ʻana ma waena o ka hiki ke kiʻekiʻe o ka huahana. Hoʻopili kēia i nā resins hydrocarbon, polyphenylene ether (PPE) i hoʻololi ʻia, nā kiʻi ʻoniʻoni PTFE, nā resins maleimide kūikawā, nā mea hoʻōla ester ikaika, a me nā mea pale ahi no nā noi 5G. Ua hoʻokumu mākou i nā pilina hoʻolako paʻa me nā mea hana CCL kaulana a me ka makani turbine. I ka manawa like, ke nānā pono nei mākou i ka hoʻomohala ʻana o ka ʻoihana AI. Ua hoʻohana ʻia kā mākou mau mea resin kiʻekiʻe ma ka nui ma nā kikowaena AI mai OpenAI a me Nvidia, e lawelawe ana ma ke ʻano he kumu kumu kumu no nā mea nui e like me nā kāleka accelerator OAM a me nā motherboards UBB.
ʻO nā noi kiʻekiʻe e lawe i kahi ʻāpana nui, ʻoi aku ka ikaika o ka PCB Capacity Expansion Momentum.
ʻO nā PCB, i kapa ʻia ʻo "makuahine o nā huahana uila," hiki ke ʻike i ka ulu hoʻihoʻi. ʻO ka PCB kahi papa kaapuni paʻi i hana ʻia me ka hoʻohana ʻana i nā ʻenehana paʻi uila e hana i nā pilina a me nā ʻāpana paʻi ma kahi substrate maʻamau e like me ka hoʻolālā i koho mua ʻia. Hoʻohana nui ʻia ia i ka uila kamaʻilio, uila uila, kamepiula, uila uila kaʻa hou, mana ʻoihana, nā mea lapaʻau, aerospace, a me nā kahua ʻē aʻe.
ʻO nā CCL kiʻekiʻe a me ka wikiwiki kiʻekiʻe ke kumu kumu no nā PCB hana kiʻekiʻe no nā kikowaena.
ʻO nā CCL nā mea koʻikoʻi o luna e hoʻoholo ai i ka hana PCB, i haku ʻia me ka foil keleawe, ka lole aniani uila, resins, a me nā mea hoʻopiha. Ma keʻano he mea lawe nui o nā PCB, hāʻawi kahi CCL i ka conductivity, insulation, a me ke kākoʻo mechanical, a ʻo kāna hana, ka maikaʻi, a me ke kumukūʻai i hoʻoholo nui ʻia e kāna mau mea i luna (ke keleawe foil, ka lole aniani, resins, silicon micropowder, etc.). Hoʻokō nui ʻia nā koi hana like ʻole ma o nā waiwai o kēia mau mea upstream.
ʻO ke koi no nā CCL kiʻekiʻe a me ka wikiwiki kiʻekiʻe e alakaʻi ʻia e ka pono no nā PCB kiʻekiʻe.. Hoʻoikaika nā CCL wikiwiki kiʻekiʻe i ka poho dielectric haʻahaʻa (Df), ʻoiai nā CCL kiʻekiʻe-frequency, e hana ana ma luna o 5 GHz i nā kikowaena ultra-high-frequency, e nānā hou aku i nā mea hoʻomau dielectric ultra-low (Dk) a me ka paʻa o Dk. ʻO ke au i ka wikiwiki kiʻekiʻe, ka hana kiʻekiʻe, a me ka mana nui i nā kikowaena ua hoʻonui i ka noi no nā PCB kiʻekiʻe a me ka wikiwiki kiʻekiʻe, me ke kī i ka hoʻokō ʻana i kēia mau waiwai e waiho ana i ka CCL.
Kiʻi: Hoʻohana nui ʻia ʻo Resin ma ke ʻano he mea hoʻopiha no ka substrate laminate ʻaʻahu keleawe.
ʻO ka hoʻomohala ʻana i ka Resin kiʻekiʻe kiʻekiʻe e hoʻolalelale i ka hoʻokomo ʻana mai
Ua kūkulu mua mākou i 3,700 tons o ka bismaleimide (BMI) resin capacity a me 1,200 tons of active ester capacity. Ua loaʻa iā mākou nā holomua ʻenehana i nā mea waiwai nui no nā PCB kiʻekiʻe a me ka wikiwiki nui, e like me ka uila BMI resin, haʻahaʻa-dielectric active ester curing resin, a me ka polyphenylene ether (PPO) resin thermosetting low-dielectric, ua hala nā mea a pau i nā loiloi e nā mea kūʻai kūloko a me nā haole kaulana.
Kūkulu ʻia o 20,000-Ton High-SpeedMea Uila Papahana
No ka hoʻonui hou ʻana i ka hiki a hoʻoikaika i kā mākou kūlana mākeke, hoʻonui i kā mākou waihona huahana, a e ʻimi ikaika i nā noi o nā mea uila ma AI, nā kamaʻilio satellite haʻahaʻa haʻahaʻa, a me nā māla ʻē aʻe, kā mākou hui Meishan EMThoʻolālā e hoʻokomo i ka "Hana Makahiki o 20,000 Tons of High-Speed Communication Substrate Electronic Materials Project" ma Meishan City, Sichuan Province. Manaʻo ʻia ka huina kālā he RMB 700 miliona, me kahi manawa hana ma kahi o 24 mau mahina. Ke hoʻokō piha ʻia, manaʻo ʻia e loaʻa ka loaʻa kālā kūʻai makahiki ma kahi o RMB 2 biliona, me ka loaʻa kālā makahiki ma kahi o RMB 600 miliona. Kuhi ʻia ka helu o ka hoʻihoʻi ma hope o ka ʻauhau ma 40%, a ʻo ka manawa hoʻihoʻi ʻauhau ma hope o ka ʻauhau i manaʻo ʻia ma 4.8 mau makahiki (me ka manawa hana).
Ka manawa hoʻouna: ʻAukake-11-2025
