photoresist (ke kalai laser i hoʻohana ʻia i ka microelectronics)
ʻO ka Bismaleimide (BMI) resin kahi mea polymer kiʻekiʻe i ʻike nui ʻia no kāna hana ʻokoʻa i nā noi kiʻekiʻe, ʻoi aku ka nui o nā ʻoihana uila a me PCB (Printed Circuit Board). Me nā waiwai kūʻokoʻa, hoʻonui ʻia ka resin BMI i mea koʻikoʻi no ka hana ʻana i nā laminates copper-clad (CCLs), ʻo ia nā kumu kumu kumu no nā PCB.
ʻO nā pono nui o ka Bismaleimide Resin i nā noi PCB
1. Haʻahaʻa Dielectric mau (Dk) a me ka Dissipation Factor (Df):
Hāʻawi ka BMI resin i nā waiwai uila maikaʻi loa me nā koina Dk a me Df haʻahaʻa, e kūpono ana ia no nā ʻōnaehana kamaʻilio kiʻekiʻe a me ka wikiwiki. He mea koʻikoʻi kēia mau waiwai no ka mālama pono ʻana i ka hōʻailona ma nā ʻōnaehana AI-driven a me nā pūnaewele 5G.
2. Kū'ē wela maikaʻi loa:
Hōʻike ka BMI resin i ke kūpaʻa wela ʻē aʻe, me ka pale ʻana i nā mahana wela me ka ʻole o ka hōʻino nui ʻana. Ua kūpono kēia waiwai no nā PCB i hoʻohana ʻia i nā kaiapuni e koi ana i ka hilinaʻi kiʻekiʻe a me ka hoʻomanawanui wela, e like me ka aerospace, automotive, a me nā ʻōnaehana kamaʻilio holomua.
3. Hoʻoheheʻe maikaʻi:
Hōʻike ka BMI resin i ka solubility maikaʻi loa i nā solvents maʻamau, e maʻalahi i ka hana a me ka hana ʻana o nā CCL. Mālama kēia hiʻohiʻona i ka hoʻohui maikaʻi ʻana i nā kaʻina hana, e hōʻemi ana i ka paʻakikī hana.
Nā noi ma PCB Manufacturing
Hoʻohana nui ʻia ka BMI resin i nā CCL hana kiʻekiʻe, hiki ke hana i nā PCB no nā noi e like me:
• Nā ʻōnaehana hoʻokele AI
• Nā pūnaewele kamaʻilio 5G
• nā mea IoT
• Nā kikowaenaʻikepili kiʻekiʻe
Hoʻoponopono huahana maʻamau
He kuleana koʻikoʻi kā mākou huahana i nā ʻano āpau o ke ola a loaʻa i nā ʻano hana like ʻole. Hiki iā mākou ke hāʻawi aku i nā mea kūʻai aku i nāʻano likeʻole o keʻano maʻamau,ʻoihana a me nā mea hoʻolale pilikino.
Aloha oekāhea iā mā˚ou, hiki i kā mākou hui ʻoihana ke hāʻawi iā ʻoe i nā hoʻonā no nā hiʻohiʻona like ʻole. No ka hoʻomaka ʻana, e ʻoluʻolu e hoʻopiha i ka palapala hoʻokaʻaʻike a e hoʻi mākou iā ʻoe i loko o 24 mau hola.
