Mea hoʻolako honua no ka mālama ʻana i ke kaiapuni
A me ka Palekana Mea Hou
Māhele Laminate a me ka Mīkini
Lamina ʻoʻoleʻa
● Nā Pepa Nui no nā polokalamu uila
| Papa | Māmā | Nā hiʻohiʻona nui |
| 3025 | E-105 ℃ | Pale ʻaʻahu |
| 3240 | B-130 ℃ |
|
| 3253 | H-180 ℃ | ʻO ka ikaika mechanical ultra-kiʻekiʻe ma lalo o ka mahana wela, ʻaʻohe halogen |
| D326 | H-180 ℃ | Ultra-kiʻekiʻe mechanical ikaika underhigh temp |
| D333 | C-200 ℃ | Ultra-kiʻekiʻe mechanical ikaika underhigh temp |
| 3242 | F-155 ℃ |
|
| D327 | F-155 ℃ | Paʻa ikaika wela, V-1 |
| D328 | F-155 ℃ | Paʻa ikaika wela, V-0，UL，benzoxazine resin |
| DF204 | F-155 ℃ | Paʻa ikaika wela, V-0，UL，epoxy resin |
| D331 | H-180 ℃ | Paʻa ikaika wela, V-0，UL，benzoxazine resin |
| D329 | H-180 ℃ | PTI ≥ 500V, V-0 ， ʻole halogen |
| D338 | H-180 ℃ | V-0 |
| D330 | B-130 ℃ | Semi-conductive, ʻeleʻele |
| D339 | F-155 ℃ | Semi-conductive, ʻeleʻele |
| D350A | H-180 ℃ | Paʻa ikaika wela kiʻekiʻe |
| EPGC201 / 202 | B-130 ℃ | G10 / FR4 ( UL ) |
| EPGC203 / 204 | F-155 ℃ | G11 / FR5 ( UL ) |
| EPGC205 | F-155 ℃ | Ka lole ulana maʻemaʻe ma ke aniani |
| EPGC306 | F-155 ℃ | CTI ≥ 500V |
| EPGC307 | F-155 ℃ | CTI ≥ 500V ， ʻO ka lole ulana maʻemaʻe ma ke aniani |
| EPGC308 | H-180 ℃ | Kūleʻa kiʻekiʻe ma hope o ka hoʻokomo ʻana i ka wai |
| DF3316A | C-200 ℃ | Kūleʻa wela kiʻekiʻe |
| DF336 | F-155 ℃ | CTI ≥ 600V, V-0 ， ʻole halogen |
● Pepa no nā noi uila ʻole
| Papa | Māmā | Nā hiʻohiʻona nui |
| D332 | F-155 ℃ | Pale ʻaʻahu |
| D3524A | F-155 ℃ | ʻeleʻele, pale ahi, ikaika kiʻekiʻe |
| DF3524B | F-155 ℃ | Haʻahaʻa haʻahaʻa, pale ahi, hoʻohana ʻia ma ke ʻano he kumu kumu |
| D325 | — | Kevlar anti-stab board，Ka palekana palekana |
| D295 | — | Prepreg. ʻO ka lole Kevlar no nā mahiole ballistic, palekana palekana |
| D332 | F-155 ℃ | Pale ʻaʻahu |
| G3849 | H-180 ℃ | Hoʻohana ʻia i nā mea hana cryogenic (haʻahaʻa haʻahaʻa i -196 ℃) |
| D3849 | F-155 ℃ | Hoʻohana ʻia i nā mea hana cryogenic (haʻahaʻa haʻahaʻa i -196 ℃) |
| Z3849 | B-130 ℃ | Hoʻohana ʻia i nā mea hana cryogenic (haʻahaʻa haʻahaʻa i -196 ℃) |
| DF3313L | B-130 ℃ | haʻahaʻa haʻahaʻa, māmā ke kaumaha, ʻO ka pepa insulation thermal maikaʻi |
| DF3314O | F-155 ℃ | haʻahaʻa haʻahaʻa, māmā ke kaumaha, ʻO ka pepa insulation thermal maikaʻi |
Māhele Mīkini
Hana ʻia nā ʻāpana mīkini i ka SMC, BMC, UPGM203 (GPO-3) prepreg, EPGC202 (FR4) a me nā mea waiwai ʻē aʻe ma ke kaomi wela a i ʻole epoxy resin/epoxy vinyl resin/unsaturated polyester resin pultrusion forming.
● 工 - ʻAno
● U - ʻAno
● L - ʻAno
● 王 - ʻAno
● Z - ʻAno
Nā noi
ʻOi aku ka lōʻihi kūikawā i hoʻokumu ʻia i ka fiber i hoʻoikaika ʻia i nā ʻāpana insulation
Hoʻohana ʻia no ka hoʻomohala ʻana i ka mana wela (ka hoʻomohala ʻana i ka mana o ke kaona, ka hana mana kinoea)
● Laina Slot
| hana | Unite | Waiwai | |
| 1 | Ka ikaika kulou (maʻamau) | MPa | ≥210 |
| 2 | Ka ikaika kulou kulou （160℃±2℃） | MPa | ≥170 |
| 3 | Ka ikaika kōmi | MPa | ≥320 |
| 4 | Ka ikaika tensile | MPa | ≥270 |
| 5 | Kū'ē Voltage AC | V/60s | 6000 |
● Papa hoʻopololei
| hana | Unite | Waiwai | |
| 1 | Kulou ikaika | MPa | ≥400 |
| 2 | Ka ikaika tensile (kū pololei) | MPa | ≥300 |
| 3 | Ka ikaika uila laminar vertical (90 ℃ aila) | MV/m | ≥16.1 |
| 4 | CTI | V | ≥500 |
● Ke apo Puʻupuʻu Insulation
| hana | ʻāpana | Waiwai | |
| 1 | Ka ikaika kulou | MPa | ≥400 |
| 2 | ʻO ka ikaika hoʻopololei vertical laminar | MPa | ≥300 |
| 3 | Haalulu wela 320 ℃/1h | __ | ʻAʻohe de-lamination, bubble, kahe resin |
| 4 | CTI |
| ≥50 |
