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Mea hoʻolako honua no ka mālama ʻana i ke kaiapuni

A me ka Palekana Mea Hou

Nā huahana resin BMI

ʻO Sichuan EM Technology Co., Ltd. ( EMT ) he mea hana ʻoihana ʻoihana honua, i hoʻohiki i ka hoʻolauna ʻana i nā ʻōnaehana palekana palekana a me ka ʻoluʻolu e hana i kahi ʻoi aku ka maikaʻi o ke ola no ke kaiāulu.

ʻO kā mākou kiʻi insulation, optical film, mica tape, resin a me nā huahana ʻē aʻe e lawelawe nui ana i ka mana UHV, mana makani, mana Solar, kamaʻilio 5G, mea uila mea kūʻai aku, nā mea pono home a me nā māla ʻē aʻe.ʻO ka maikaʻi maikaʻi o nā huahana a me nā lawelawe i ʻike ʻia ma ka ʻoihana.

Ma hope o nā makahiki o ka noiʻi a me ka hoʻomohala ʻana a me ka hoʻonohonoho ʻana, ua loaʻa iā mākou ka kūleʻa nui i nā huahana resin BMI kiʻekiʻe no ka Copper Clad Laminates.

Inoa Huahana: BMI Resin (Maleamide Resin).

Papa: DFE936, DFE950

1.DFE936

ʻO kēia huahana he monomer resin thermosetting haʻahaʻa haʻahaʻa, hiki ke hoʻohana ʻia e like me ka hoʻololi ʻana i ka wela o ka epoxy resin, nona kahi kaulahao pōkole e kōkua ai e hoʻonui i ka molecular spacing, a laila hoʻonāwaliwali i ka crystallinity o ka resin, hoʻomaikaʻi i ka solubility, hoʻonā i ka pilikia o ka hoʻoheheʻe maikaʻi ʻole o ka resin maleimide pālua maʻamau, no ka hoʻomākaukau ʻana i nā papa kaapuni paʻi kiʻekiʻe, nā mea insulation F-class, nā mea kūʻai abrasion-kūpono kiʻekiʻe, etc.

Nā huahana resin BMI1 Nā huahana resin BMI2

Nā ʻāpana hana:

helu

inoa metric

hui

Kūlana hoʻāʻo

Ka waiwai metric

Nā waiwai maʻamau

1

Ka nana aku

/

Nānā maka maka

Pauda paʻa keʻokeʻo

Pauda paʻa keʻokeʻo

2

Lae hehee

DSC,10℃/min,N2

160—170

168

3

ʻakika

mg KOH/g

HG/T 2708-1995

<1.0

0.3-0.5

4

Maʻiʻo

wt%

HPLC

≥97

98.1~98.4

Nā noi:

1.1 Hiki ke copolymerized ka huahana me ka diallyl bisphenol A ma ke ʻano he resin matrix composite, ka mea kū i ka wela kiʻekiʻe, radiation a me ka ikaika kiʻekiʻe.

1.2 Hiki ke hoʻololi ʻia ka huahana me ka resin epoxy maʻamau no ka hoʻomākaukau ʻana i nā mea insulation, nā mea hoʻopili wela kiʻekiʻe, a me nā mea ʻē aʻe, a kūʻē nā huahana i nā wela kiʻekiʻe, ka insulation maikaʻi a me ka paʻakikī maikaʻi ma hope o ka composite.

1.3 He mea hiki ke hoʻoheheʻe a hoʻoheheʻe ʻia ka huahana, a hiki ke hoʻohana ʻia e ʻaʻahu a impregnate i nā mea fiber, etc., kūpono no nā mea nui.

2. DFE 950

ʻO kēia huahana he haʻahaʻa haʻahaʻa haʻahaʻa thermosetting resin, hiki ke hoʻohana ʻia e like me ka mea hoʻololi wela o ka epoxy resin, ʻo kona ʻano o ka nui maleimide e hoʻonāwaliwali i ka crystallinity o ka resin, hoʻomaikaʻi i ka solubility, hoʻonā i ka pilikia o ka solubility maikaʻi ʻole o ka resin maleimide pālua. , hiki ke hoʻopili pololeiʻia no ka hoʻomākaukauʻana i ka papa kaapuni paʻi kiʻekiʻe, F-class insulation materials, high-performance abrasion-resistant materials, etc.

Nā huahana resin BMI3 Nā huahana resin BMI4

Nā waiwai:

helu

inoa metric

hui

Kūlana hoʻāʻo

Ka waiwai metric

Nā waiwai maʻamau

1

Ka nana aku

Ma nā wahi mālamalama maikaʻi, e nānā me ka maka

Paʻa melemele ʻulaʻula

Paʻa melemele ʻulaʻula

2

Nā kiko hoʻoluʻu

Kānāwai Globe

75~90

80~85

3

ʻakika

mg KOH/g

HG/T 2708-1995

<3.0

1.0~1.5

4

Ka hikiwawe

25 ℃,50wt% DMF/MEK(wt/wt=1:1)

Akaka a maopopo

Akaka a maopopo

Nā noi

2.1 Hiki ke copolymerized nā huahana me ka diallyl bisphenol A, cyanate, amine curing agent, polyphenylene ether, a me nā mea ʻē aʻe ma ke ʻano he resin kumu no nā mea hoʻohuihui, i kū i ka wela kiʻekiʻe, radiation a me ka ikaika kiʻekiʻe.

2.2 Hiki ke hoʻololi i ka huahana me ka epoxy resin maʻamau, i hoʻohana ʻia no ka hoʻomākaukau ʻana i nā mea insulation, nā mea hoʻopili kiʻekiʻe-mehana, a me nā mea ʻē aʻe, a kūʻē nā huahana i ka wela kiʻekiʻe, ka insulation maikaʻi a me ka paʻakikī maikaʻi ma hope o ka composite.

2.3 He mau hiʻohiʻona hiki ke hoʻoheheʻe ʻia ka huahana, a hiki ke hoʻohana ʻia e ʻaʻahu a impregnate i nā mea fiber, etc., kūpono no nā mea nui.

ʻO DFE936 & DFE950 nā koho maikaʻi no ka hoʻomākaukau ʻana i nā papa lawe, nā mea lawe like me ka pā a me nā CCL kiʻekiʻe.

Nā huahana resin BMI5

E ʻoluʻolu e kelepona mai iā mākou, e kōkua mākou iā ʻoe e hoʻopaʻa i kāu ʻoihana CCL.

Mea hoʻopili: Mr. Feng,fengjing@emtco.com


Ka manawa hoʻouna: Jun-07-2022

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