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Mea hoʻolako honua no ka mālama ʻana i ke kaiapuni

A me ka Palekana Mea Hou

ʻO ka Resin Electronic Specific

Ma ke kahua o nā resins uila, ua kūpaʻa mākou i ka hāʻawi ʻana i ka resin hana kiʻekiʻe a hoʻāʻo e hāʻawi i nā hopena holoʻokoʻa no ke kahua o CCL. Manaʻo e hoʻomaopopo i ka localization o ka resin uila no ka hōʻike a me ka IC, ua kūkulu mākou i 110,000 tons o ka hale hana epoxy resin kūikawā, e hoʻolako ana i ka benzene a me ka resin oxazine, ka uila uila o ka resin epoxy, ka resin phenolic, ke ʻano o ka resin hydrocarbon, a me ka mea hoʻōla ester ikaika, monomer kūikawā. a me maleic imide resin moʻo.


Nā kiʻi noiʻi

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Benzoxazines Resin
ʻO ka moʻo haʻahaʻa ʻo Benzoxazine Resin
ʻO ka moʻo resin hydrocarbon i hoʻololi ʻia
ʻO ka pūʻulu haku mele hydrocarbon resin
Ester ʻeleu
Monomer Resin Kūikawā
Maleimide Resin moʻo
Benzoxazines Resin

ʻO kā mākou hui ka hui mua i ʻike i ka hana ʻoihana nui o Benzoxazine Resin ma Kina, a aia i ke kūlana alakaʻi i ka hana, noiʻi a me nā kahua noiʻi o Benzoxazine Resin. Ua hala nā huahana Benzoxazine Resin o kā mākou hui i ka ʻike SGS, a ʻaʻole i loaʻa nā mea ʻino a me RoHS (Pb, CD, Hg, Gr (VI), PBB, PBDE). ʻO ka hiʻohiʻona, ʻaʻohe mole liʻiliʻi i hoʻokuʻu ʻia i ka wā o ke kaʻina hana hoʻōla a ʻaneʻane ʻaʻole ka emi ʻana o ka leo; ʻO nā huahana ho'ōla i nā hiʻohiʻona o ka haʻahaʻa wai haʻahaʻa, haʻahaʻa haʻahaʻa ikehu, maikaʻi UV kū'ē, maikaʻi wela kū'ē, kiʻekiʻe koena kalapona,ʻaʻohe pono o ka ikaika acid catalysis a wehe-loop curing.lt ua nui hoʻohana 'ia i ka uila keleawe aahu laminates, laminates. , nā mea hoʻohuihui, nā mea aerospace, nā mea friction a me nā māla ʻē aʻe.

Inoa

Papa No

Ka nana aku

hooluolu

kiko

(°C)

Kuokoa

Phenol

(%)

GT (s @210℃)

Viscosity

NV

(%)

waiwai

MDA ʻano Benzoxazine

DFE125

ʻulaʻula ʻulaʻula ʻulaʻula ʻulaʻula

-

≤ 5

100-230

30-70 (s,4# 杯)

70±3

Tg kiʻekiʻe, kūpaʻa wela kiʻekiʻe, pale ahi ʻole halogen, ikaika kiʻekiʻe a paʻakikī

ʻO ka ʻano BPA Benzoxazine

DFE127

ʻO ka wai aniani melemele

-

≤ 5

1100-1600

200-800

Mpa·s

80 土 2

ʻO ka modulus kiʻekiʻe, ke kūpaʻa wela kiʻekiʻe, ka pale ahi ʻole halogen, ka haʻahaʻa o ka wai

ʻO ka ʻano BPA Benzoxazine

DFE127A

Melemele paʻa

60-85

≤ 5

500-800

-

98±1,5

ʻO ka modulus kiʻekiʻe, ke kūpaʻa wela kiʻekiʻe, ka pale ahi ʻole halogen, ka haʻahaʻa o ka wai

ʻO ka BPF ʻano Benzoxazine

DFE128

ʻulaʻula ʻulaʻula ʻulaʻula ʻulaʻula

-

≤ 5

350-400

30-100

(s,4# 杯)

75±2

ʻO ka paʻakikī maikaʻi, ke kūpaʻa wela kiʻekiʻe, ka pale ahi ʻole halogen, ka haʻahaʻa wai haʻahaʻa a me ka viscosity haʻahaʻa.

ʻO ka ʻano ODA Benzoxazine

DFE129

ʻulaʻula ʻulaʻula ʻalohi

-

≤ 2

120-500

<2000

mpa.s

65 土 3

Tg: 212°C, Free PlienoK≤ 2%,

Dk: 2.92, Df0.0051

ʻO ka moʻo haʻahaʻa ʻo Benzoxazine Resin

ʻO Benzoxazine Resin dielectric haʻahaʻa he ʻano Benzoxazine Resin i hoʻomohala ʻia no ke alapine kiʻekiʻe a me ke kiʻekiʻe kiʻekiʻe o ka laminate copper clad. ʻO kēia ʻano resin nā hiʻohiʻona o Dk / DF haʻahaʻa a me ke kūpaʻa wela kiʻekiʻe. Hoʻohana nui ʻia ia i ka M2, M4 grade copper clad laminate a i ʻole HDI board, multilayer board, composite material, friction material, aerospace a me nā māla ʻē aʻe.

Inoa

Papa No

Ka nana aku

hooluolu

kiko

rc>

Kuokoa

Phenol

(%)

GT (s @210℃)

Viscosity

NV (%)

waiwai

Benzoxazine dielectric haʻahaʻa

DFE130

Melemele granular a paʻa nui paha

55-80

≤ 5

400-600

≥98.5

Dk: 2.75, Tg:196 ℃:

Ho'ōla wikiwiki i ka benzoxazine ma ka wela haʻahaʻa

DFE146

ʻO ka wai aniani melemele ʻeleʻele

-

≤ 5

100-130

<200 (s,4# 杯)

75±2

Dk: 3.04, Df: 0.0039 Kiʻekiʻe hoʻōla wikiwiki, kiʻekiʻe Tg a haʻahaʻa dielectric

ʻO Benzoxazine me ka paʻa pālua

DFE148

ʻulaʻula ʻulaʻula ʻulaʻula ʻulaʻula

-

≤ 5

ʻOiaʻiʻo

ana ana

<2000

Mpa·s

80±2

Hiki iā ia ke hana me nā resins ʻē aʻe i loaʻa ka paʻa pālua

Benzoxazine kaulahao nui

DFE149

ʻO ka wai aniani melemele ʻeleʻele

-

≤ 3

80-160

<2000

Mpa·s

70 土 2

Tg: 215#C, Td5%: 380°C, Dk: 2.87, Df0.0074 (10GHz)

ʻO ka ʻano DCPD Benzoxazine

DFE150

ʻulaʻula ʻulaʻula ʻeleʻele wai

-

≤ 3

2000-2500

<1000

Mpa·s

75±2

Dk: 2.85, Df: 0.0073 (10GHz)

ʻO Bisphenol benzoxazine

DFE153

ʻO ka wai aniani melemele ʻeleʻele

≤ 3

100-200

<2000

Mpa·s

70±2

Dk: 2.88, Df: 0.0076 (10GHz) ,

ʻO ka moʻo resin hydrocarbon i hoʻololi ʻia

He ʻano koʻikoʻi ʻo Hydrocarbon resin series i ka resin substrate circuit circuit ma 5g kahua. Ma muli o kāna ʻano hana kemika kūikawā, loaʻa iā ia ka dielectric haʻahaʻa, ke kūpaʻa wela maikaʻi a me ke kūpaʻa kemika. Hoʻohana nui ʻia ia i ka 5g copper clad laminates, laminates, flame retardant material, high temperature resistant insulating paint, adhesives and casting materials. Loaʻa nā huahana i ka resin hydrocarbon i hoʻololi ʻia a me ka haku mele hydrocarbon resin.

ʻO ka resin hydrocarbon i hoʻololi ʻia he ʻano hydrocarbon resin i loaʻa e kā mākou hui ma o ka hoʻololi ʻana i nā mea waiwai hydrocarbon. Loaʻa iā ia nā waiwai dielectric maikaʻi, ʻike vinyl kiʻekiʻe, ikaika peel kiʻekiʻe, a me nā mea ʻē aʻe, a hoʻohana nui ʻia i nā mea kiʻekiʻe.

Inoa

Papa

No

Ka nana aku

NV

(%)

Viscosity

(mPa.s)

waiwai

Hoʻololi ʻia ka styrene butadiene resin

DFE401

Wai melemele māmā

35±2.0

<3000

ʻO ke kaumaha molekala kiʻekiʻe a me ka dielectric haʻahaʻa. Hoʻohana nui ʻia i ka resin hydrocarbon, polyphenylene ether a me ka ʻōnaehana resin peek

Epoxy resin i hoʻololi ʻia i ka styrene butadiene resin

DFE402

Wai waihoʻoluʻu a melemele

60±2.0

<5000

ʻO ka epoxy i hoʻololi ʻia e Anhydride me nā waiwai dielectric haʻahaʻa

hoʻohana nui ʻia i nā mea kiʻekiʻe-wikiwiki

Styrene butadiene resin me nā waiwai dielectric haʻahaʻa

DFE403

60±2.0

<2000

ʻIke vinyl kiʻekiʻe, kiʻekiʻe crosslinking density, hoʻohana nui ʻia i ka resin hydrocarbon, polyphenylene ether a me ka ʻōnaehana resin peek

ʻO ka resin hydrocarbon i hoʻololi ʻia

DFE404

40+2.0

<2000

Haʻahaʻa dielectric, haʻahaʻa wai absorption, kiʻekiʻe peel ikaika

Hoʻololi ʻia ka polystyrene resin

DFE405

60 土 2.0

<3000

ʻIke vinyl kiʻekiʻe, kiʻekiʻe crosslinking density, hoʻohana nui ʻia i ka resin hydrocarbon, polyphenylene ether a me ka ʻōnaehana resin peek

ʻO ka resin hydrocarbon i hoʻololi ʻia

DFE406

35±2.0

<2000

Haʻahaʻa wai absorption, kiʻekiʻe peel ikaika, maikaʻi dielectric

waiwai

resina hydrocarbon

DFE412

Wai melemele māmā

50 土 2.0

<8000

Modulus kiʻekiʻe, kaumaha molekala kiʻekiʻe a me ka dielectric haʻahaʻa

ʻO resin paʻa pālua me nā waiwai dielectric haʻahaʻa

DFE416

Wai waihoʻoluʻu a melemele

60+2.0

<2000

ʻIke vinyl kiʻekiʻe, kiʻekiʻe crosslinking density, hoʻohana nui ʻia i ka resin hydrocarbon, polyphenylene ether a me ka ʻōnaehana resin peek

ʻO ka pūʻulu haku mele hydrocarbon resin

ʻO ka hydrocarbon resin composite kahi ʻano o ka hydrocarbon resin composite i hoʻomohala ʻia e kā mākou hui no 5g kamaʻilio. Ma hope o ke kuʻi ʻana, hoʻomaloʻo, laminating a me ke kaomi ʻana, loaʻa i ka composite nā waiwai dielectric maikaʻi loa, ka ikaika peel kiʻekiʻe, ka pale wela maikaʻi a me ka retardancy ahi maikaʻi. Hoʻohana nui ʻia ia ma 5g base station, antenna, power amplifier, radar a me nā mea kiʻekiʻe kiʻekiʻe.carbon resin i loaʻa e kā mākou hui ma o ka hoʻololi ʻana i nā mea waiwai hydrocarbon. Loaʻa iā ia nā waiwai dielectric maikaʻi, ʻike vinyl kiʻekiʻe, ikaika peel kiʻekiʻe, a me nā mea ʻē aʻe, a hoʻohana nui ʻia i nā mea kiʻekiʻe.

Inoa

Papa No

Ka nana aku

NV

(%)

waiwai

ʻO ka hoʻohui ʻana i ka resin hydrocarbon

DFE407

He wai keʻokeʻo a melemele

65 ±2.0

Dk/Df: 3.48/0.0037 Hoʻohana nui ʻia i ka mana hoʻonui (V0)

DFE407A

65 ±2.0

Dk: 3.52

High fluidity, hoʻohana nui ʻia i ka hana ʻana o ka adhesive

pepa

DFE408

65 ±2.0

Dk/Df: 3.00/0.0027

Hoʻohana nui ʻia ma ke kahua kahua a me ka antenna (papa multilayer, flame retardant V0)

DFE408A

65 ±2.0

Dk: 3.00

High fluidity, hoʻohana nui ʻia i ka hana ʻana o ka adhesive

pepa

DFE409

65 ±2.0

Dk/Df: 3.30/0.0027

Hoʻohana nui ʻia i ka antenna (papa ʻelua ʻaoʻao, non flame retardant V0)

DFE410

65 ±2.0

Dk/Df: 3.40/0.0029

Hoʻohana nui ʻia i ka antenna (papa ʻelua ʻaoʻao, non flame retardant V0)

DFE411

65 土 2.0

Dk/Df: 3.38/0.0027

Hoʻohana nui ʻia i ka mana amplifier (non flame retardant)

Ester ʻeleu

Hoʻopili ʻo ia i ka mea hoʻōla ester ikaika me ka resin epoxy e hana i ka pahu me ka ʻole o ka hui hydroxyl waiʻona lua. Loaʻa i ka ʻōnaehana hoʻōla nā hiʻohiʻona o ka haʻahaʻa wai haʻahaʻa a me Dk / Df haʻahaʻa.

Inoa

Papa No

helehelena

Ester like

NV

(%)

Viscosity (卬s)

wahi palupalu

rc)

Mea ho'ola ester ha'aha'a dielectric

DFE607

ʻO ka wai viscous ʻeleʻele māmā

230〜240

69 ±1.0

1400〜1800

140〜150

DFE608

wai ʻulaʻula ʻulaʻula

275-290

69±1.0 Loaʻa nā paʻa

800-1200

140-150

DFE609

wai ʻulaʻula

275-290

130-140

DFE610

wai ʻulaʻula

275-290

100-110

Monomer Resin Kūikawā

ʻOi aku ka nui o ka phosphorus ma mua o 13%, ʻoi aku ka nui o ka nitrogen ma mua o 6%, a ʻoi aku ka maikaʻi o ke kūpaʻa hydrolysis. He kūpono ia no ka laminate copper copper clad, capacitor packaging a me nā māla ʻē aʻe.

ʻO ka BIS-DOPO ethane kahi ʻano o nā mea hoʻohuihui phosphate, ʻaʻohe halogen-free environmental flame retardant. ʻO ka huahana he pauda keʻokeʻo paʻa. He maikaʻi loa ka paʻa wela a me ka paʻa kemika, a ʻoi aku ka mahana o ka decomposition ma luna o 400 °C. ʻO kēia huahana he mea hiki ke pale i ke ahi a me ke kaiapuni. Hiki iā ia ke hoʻokō piha i nā koi kaiapuni o ka European Union. Hiki ke hoʻohana ʻia ma ke ʻano he pale ahi i ke kahua o ka laminate ʻaʻahu keleawe. Eia kekahi, ʻoi aku ka maikaʻi o ka huahana me ka polyester a me ka nylon, no laila he maikaʻi loa ka spinnability i ke kaʻina wili, maikaʻi ka wili mau a me nā waiwai kala, a hoʻohana nui ʻia i ke kula o ka polyester a me ka nylon.

Inoa

Papa

No

Ka nana aku

hehee ana

kiko

(℃)

P%

%

N%

(%)

Td5%(℃)

Waiwai

ʻO Phosphazene ka pale ahi

DFE790

Pauka lepo keʻokeʻo a melemele paha

108 ±4.0

≥13

≥6

≥320

ʻO nā mea phosphoms kiʻekiʻe, ka pale ahi, ke kūpaʻa wela kiʻekiʻe, ke kūpaʻa hydrolysis, kūpono no ka laminate ʻaʻahu keleawe a me nā māla ʻē aʻe.

Inoa

Papa

No

Ka nana aku

maʻiʻo

%

hehee ana

kiko

CC)

P%

%

Td2%

V

Waiwai

BIS-DOPO etana

DFE791

Pauda keʻokeʻo

≥99

290-295

≥13

≥400

Maʻiʻo ion Chloride< 20ppm, wahi hehee kiʻekiʻe, mānoanoa pohā kiʻekiʻe, haʻahaʻa e^ansion coefficient

Maleimide Resin moʻo

ʻO DFE930n DFE936> DFE937, DFE939 ^ DFE950 a me DFE952 he mau resins maleimide uila me ka maʻemaʻe kiʻekiʻe, ka liʻiliʻi o nā haumia a me ka solubility maikaʻi. Ma muli o ke ʻano o ke apo imine i loko o ka mole, he ikaika ko lākou rigidity a me ke kūpaʻa wela maikaʻi. Hoʻohana nui ʻia lākou i nā mea aerospace structural, carbon fiber kiʻekiʻe kiʻekiʻe wela structural ʻāpana, kiʻekiʻe wela kū i ka impregnating pena, laminates, copper clad laminates, molded plastics, etc. nā mea hana, nā ʻāpana hoʻolei a me nā mea iunctional ʻē aʻe a me nā māla ʻenehana kiʻekiʻe.

Inoa

Papa NO

Ka nana aku

Heheʻe

kiko

(℃)

Waiwai ʻakika ( mg KOH/g)

Huʻihuʻi

maʻiʻo

(%)

(5mm) Hoʻoheheʻe ʻia o toluene wela (5min)

Waiwai

Bismaleimide papa uila

DFE928

Nā ʻāpana paʻa melemele

158±2

≤3.0

≤0.3

Hiki ke hoʻoheheʻe ʻia

Kūleʻa wela kiʻekiʻe

ʻO ka diphenylmethane Bismaleimide papa uila

DFE929

Nā ʻāpana paʻa melemele māmā

162 ±2

≤1.0

≤0.3

ʻO ka maʻemaʻe kiʻekiʻe a me ka waiwai haʻahaʻa o ka waikawa

Bismaleimide papa uila

DFE930

ʻO ka pauka keʻokeʻo melemele māmā

160 ±2

≤1.0

≤0.3

Maʻemaʻe kiʻekiʻe aad haʻahaʻa acid^lue

Bismaleimide kristal haʻahaʻa

DFE936

168 ±2

≤1.0

≤0.3

Hoʻoheheʻe maikaʻi

Haʻahaʻa crystalline a haʻahaʻa dielectric Bismaleimide

DFE937

168 ±2

≤1.0

≤0.3

Hoʻoheheʻe maikaʻi

Phenyl bismaleimide me ka helu heheʻe haʻahaʻa

DFE939

Paʻa ʻeleʻele māmā a i ʻole ka pauka paʻa melemele

50 土 10

≤3.0

≤0.3

Hoʻoheheʻe maikaʻi

polymaleimide wahi hoohehee haahaa

DFE950

50 ±10

≤3.0

≤0.3

Hoʻoheheʻe maikaʻi

Tetramaleirnide wahi meltmg haʻahaʻa

DFE952

50 ±10

≤3.0

≤0.3

Hoʻoheheʻe maikaʻi

E waiho i kāu leka i kāu hui

E kākau i kāu leka ma aneʻi a hoʻouna mai iā mākou

Waiho i kāu leka