Mea hoʻolako honua no ka mālama ʻana i ke kaiapuni
A me ka Palekana Mea Hou
ʻO ka Resin Electronic Specific
Nā kiʻi noiʻi
ʻO kā mākou hui ka hui mua i ʻike i ka hana ʻoihana nui o Benzoxazine Resin ma Kina, a aia i ke kūlana alakaʻi i ka hana, noiʻi a me nā kahua noiʻi o Benzoxazine Resin.Ua hala nā huahana Benzoxazine Resin o kā mākou hui i ka ʻike SGS, a ʻaʻole i loaʻa nā mea ʻino a me RoHS (Pb, CD, Hg, Gr (VI), PBB, PBDE).ʻO ka hiʻohiʻona, ʻaʻohe mole liʻiliʻi i hoʻokuʻu ʻia i ka wā o ke kaʻina hana hoʻōla a ʻaneʻane ʻaʻole ka emi ʻana o ka leo;ʻO nā huahana ho'ōla i nā hiʻohiʻona o ka haʻahaʻa wai haʻahaʻa, haʻahaʻa haʻahaʻa ikehu, maikaʻi UV kū'ē, maikaʻi wela kū'ē, kiʻekiʻe koena kalapona,ʻaʻohe pono o ka ikaika acid catalysis a wehe-loop curing.lt ua nui hoʻohana 'ia i ka uila keleawe aahu laminates, laminates. , nā mea hoʻohuihui, nā mea aerospace, nā mea friction a me nā māla ʻē aʻe.
| inoa | Papa No | Ka nana aku | hooluolu kiko (°C) | Kuokoa Phenol (%) | GT (s @210℃） | ʻO ka viscosity | NV (%) | waiwai |
| MDA ʻano Benzoxazine | DFE125 | ʻulaʻula ʻulaʻula ʻulaʻula ʻulaʻula | - | ≤ 5 | 100-230 | 30-70 (s,4# 杯） | 70±3 | Tg kiʻekiʻe, kūpaʻa wela kiʻekiʻe, pale ahi ʻole halogen, ikaika kiʻekiʻe a paʻakikī |
| ʻO ka ʻano BPA Benzoxazine | DFE127 | ʻO ka wai aniani melemele | - | ≤ 5 | 1100-1600 | 200-800 Mpa·s | 80 土 2 | ʻO ka modulus kiʻekiʻe, ke kūpaʻa wela kiʻekiʻe, ka pale ahi ʻole halogen, ka haʻahaʻa o ka wai |
| ʻO ka ʻano BPA Benzoxazine | DFE127A | Melemele paʻa | 60-85 | ≤ 5 | 500-800 | - | 98±1,5 | ʻO ka modulus kiʻekiʻe, ke kūpaʻa wela kiʻekiʻe, ka pale ahi ʻole halogen, ka haʻahaʻa o ka wai |
| ʻO ka BPF ʻano Benzoxazine | DFE128 | ʻulaʻula ʻulaʻula ʻeleʻele wai | - | ≤ 5 | 350-400 | 30-100 (s，4# 杯） | 75±2 | ʻO ka paʻakikī maikaʻi, ke kūpaʻa wela kiʻekiʻe, ka pale ahi ʻole halogen, ka haʻahaʻa wai haʻahaʻa a me ka viscosity haʻahaʻa. |
| ʻO ka ʻano ODA Benzoxazine | DFE129 | ʻulaʻula ʻulaʻula ʻālohilohi | - | ≤ 2 | 120-500 | <2000 mpa.s | 65 土 3 | Tg: 212°C, Free PlienoK≤ 2%， Dk: 2.92, Df：0.0051 |
ʻO Benzoxazine Resin dielectric haʻahaʻa he ʻano Benzoxazine Resin i hoʻomohala ʻia no ke alapine kiʻekiʻe a me ka wikiwiki kiʻekiʻe o ka laminate copper clad.ʻO kēia ʻano resin nā hiʻohiʻona o Dk / DF haʻahaʻa a me ke kūpaʻa wela kiʻekiʻe.Hoʻohana nui ʻia ia i ka M2, M4 grade copper clad laminate a i ʻole HDI board, multilayer board, composite material, friction material, aerospace a me nā māla ʻē aʻe.
| inoa | Papa No | Ka nana aku | hooluolu kiko rc> | Kuokoa Phenol (%) | GT (s @210℃） | ʻO ka viscosity | NV (%) | waiwai |
| Benzoxazine dielectric haʻahaʻa | DFE130 | ʻO ke kala melemele a i ʻole ka paʻa nui | 55-80 | ≤ 5 | 400-600 | — | ≥98.5 | Dk: 2.75, Tg:196 ℃: |
| Ho'ōla wikiwiki i ka benzoxazine ma ka wela haʻahaʻa | DFE146 | ʻO ka wai aniani melemele ʻeleʻele | - | ≤ 5 | 100-130 | <200 (s，4# 杯） | 75±2 | Dk: 3.04, Df: 0.0039 Kiʻekiʻe hoʻōla wikiwiki, kiʻekiʻe Tg a haʻahaʻa dielectric |
| ʻO Benzoxazine me ka paʻa pālua | DFE148 | ʻulaʻula ʻulaʻula ʻulaʻula ʻulaʻula | - | ≤ 5 | ʻOiaʻiʻo ana ana | <2000 Mpa·s | 80±2 | Hiki iā ia ke hana me nā resins ʻē aʻe i loaʻa ka paʻa pālua |
| Benzoxazine kaulahao nui | DFE149 | ʻO ka wai aniani melemele ʻeleʻele | - | ≤ 3 | 80-160 | <2000 Mpa·s | 70 土 2 | Tg: 215#C, Td5%: 380°C, Dk: 2.87, Df：0.0074 (10GHz) |
| ʻO ka ʻano DCPD Benzoxazine | DFE150 | ʻulaʻula ʻulaʻula ʻeleʻele wai | - | ≤ 3 | 2000-2500 | <1000 Mpa·s | 75±2 | Dk: 2.85, Df: 0.0073 (10GHz) |
| ʻO Bisphenol benzoxazine | DFE153 | ʻO ka wai aniani melemele ʻeleʻele | 一 | ≤ 3 | 100-200 | <2000 Mpa·s | 70±2 | Dk: 2.88, Df: 0.0076 (10GHz) , |
ʻO Bisphenol A epoxy resin o kā mākou hui e komo i ka wai epoxy resin, solid epoxy resin a me ka solvent epoxy resin, nona ka hydrolysis chlorine haʻahaʻa a hoʻohana nui ʻia i nā uhi, nā mea uila, nā mea hoʻohui a me nā māla ʻē aʻe.
| inoa | Papa No | EEW (g/eq) | kalakala (G) | ʻO ka viscosity (mPa.s) | Hy-Cl (ppm) |
| Liquid bisphenol He resin epoxy | EMTE126 | 165-175 | ≤0.5 | 3000-5000 | <200 |
| EMTE127 | 180-190 | ≤1 | 8000-11000 | <500 | |
| EMTE128 | 184-194 | ≤1 | 12000-15000 | <500 | |
| EMTE128H | 184-194 | ≤1 | 12000-15000 | <100 | |
| inoa | Papa No | EEW(g/eq) | kalakala (G) | Lahi hooluolu (℃) | |
| Bisphenol paʻa A epoxy resin | DFE1011 | 450-500 | ≤1 | 60-70 | |
| DFE1901 | 450-500 | ≤1 | 65-75 | ||
| inoa | Papa No | EEW (g/eq) | kalakala (G) | ʻO ka viscosity (mPa.s) | NV (%) |
| ʻAno hoʻonā wai bisphenol A epoxy resin | DFE1901EK70 | 450-500 | ≤1 | 2000-5000 | 70±1 |
Loaʻa i ka Bisphenol F epoxy resin nā hiʻohiʻona o ka viscosity haʻahaʻa, ka wai maikaʻi a me ka pulu, a ua loaʻa i kā mākou hui kahi ʻenehana hana bisphenol F kūʻokoʻa me nā lako maka.Hoʻohana nui ʻia nā huahana i nā mea hoʻoheheʻe ʻole, ka hoʻolei ʻana, nā adhesives, nā mea insulation a me nā māla ʻē aʻe.
| inoa | Papa No | EEW (g/eq) | ʻO ka viscosity (mPa·s) | kalakala (G) | Hy-Cl (ppm) |
| ʻO ka wai bisphenol F epoxy resin | EMTE160 | 155-165 | ≤1600 | ≤1 | ≤100 |
| EMTE170L | 165-175 | 2900-3500 | ≤1 | ≤100 | |
| EMTE170 | 165-175 | 3500-4500 | ≤1 | ≤100 | |
| EMTE170H | 165-175 | 5000-6000 | ≤1 | ≤100 | |
| EMTE170K | 165-175 | 5000-6000 | ≤1 | ≤200 | |
| inoa | Papa No | EEW (g/eq) | kalakala (G) | Lahi hooluolu (℃) | |
| Bisphenol F epoxy resin paʻa | DFE1701 | 450-500 | ≤1 | 45-55 | |
| DFE1702 | 600-700 | ≤1 | 75-85 | ||
| DFE1703 | 700-800 | ≤1 | 85-95 | ||
| DFE1704D | 900-1000 | ≤1 | 90-100 | ||
| DFE1707D | 1300-1700 | ≤1 | 100-110 | ||
ʻO kā mākou phenolic epoxy resins he ʻano PNE, ʻano BNE a me ke ʻano CNE.ʻO kā lākou huahana i ho'ōla ʻia he kiʻekiʻe crosslinking density, ka ikaika hoʻopaʻa maikaʻi loa, ka pale wela a me ka pale kemika.Hoʻohana nui ʻia lākou i nā laminates uila keleawe, nā laminates uila, nā mea hoʻopili wela, nā composites, nā uhi wela kiʻekiʻe, nā ʻenekinia kīwila a me nā inika uila.
| inoa | Papa No | EEW (g/eq) | wahi palupalu (°C) | kalakala (G) | Hy-Cl (ppm) |
| PNE ano phenolic epoxy resin | DFE1638 | 171-180 | 36-40 | ≤0.5 | ≤200 |
| DFE1638S | 171-179 | 36-40 | ≤0.5 | ≤200 | |
| DFE1636 | 170-178 | 27-31 | <1 | <300 | |
| DFE1637 | 170-178 | 31-36 | <1 | <300 | |
| DFE1639 | 174-180 | 44-50 | <1 | <300 | |
| DFE1625 | 168-178 | 9000-13000mpa·s | ≤1 | <300 | |
| BNE ano phenolic epoxy resin | DFE1200 | 200-220 | 60-70 | <3 | <500 |
| DFE1200H | 205-225 | 70-80 | <3 | <500 | |
| DFE1200HH | 210-230 | 80-90 | <3 | <500 | |
| CNE ano phenolic epoxy resin | DFE1701 | 196-206 | 65-70 | <2 | <500 |
| DFE1702 | 197-207 | 70-76 | <2 | <500 | |
| DFE1704 | 200-215 | 88-93 | <2 | <1000 | |
| DFE1704M | 200-215 | 83-88 | <2 | <1000 | |
| DFE1704ML | 200-210 | 80-85 | <2 | <1000 | |
| DFE1704L | 207-215 | 78-83 | <2 | <1000 | |
| inoa | Papa No | EEW (g/eq) | ʻO ka viscosity (mPa.s) | NV (%) | |
| ʻAno hoʻonā ʻano phenolic epoxy resin | DFE236 | 200-220 | 1000-4000 | 80±1 | |
| DFE238 | 170-190 | 200-500 | 80 土 1 | ||
ʻO nā resins epoxy me ka Phosphorus ka nui o nā ʻano ʻekolu, ʻo ia hoʻi ke ʻano DOPO, DOPO-HQtype a me DOPO-NQtype.He maikaʻi loa lākou i ka pale ahi a me ka pale wela, a he haʻahaʻa ka wai absorption a me ka hoʻonui coefficient. No lākou i ka halogen-free flame retardant epoxy resin, a kūlike me RoHS a me WEEE Directive. papa, laminate keleawe aahu uila, laminate uila a me nā māla huahana ʻē aʻe.
| inoa | Papa No | Ka nana aku | NV (%) | EEW (g/eq) | ʻO ka viscosity (mPa.s) | P% (%) |
| DOPO-HQ hoʻololi phenolic epoxy resin | DFE200 | ʻulaʻula ʻulaʻula ʻeleʻele wai | 70±1.0 | 320 ±20 | <1000 | 2.0±0.1 |
| DOPO-HQ hoʻololi phenolic epoxy resin | DFE200A | ʻulaʻula ʻulaʻula ʻeleʻele wai | 70±1.0 | 275 ±25 | <1000 | 1.0±0.1 |
| DOPO-HQ hoʻololi phenolic epoxy resin | DFE200C | ʻO ka wai aniani melemele | 80±1.0 | 255 ±15 | 1000-7000 | 2.0±0.1 |
| DOPO-HQ hoʻololi phenolic epoxy resin | DFE200D | ʻO ka wai aniani melemele | 80±1.0 | 230±20 | 1000-4000 | 1.0±0.1 |
| DOPO-NQ hoʻololi phenolic epoxy resin | DFE201 | ʻulaʻula ʻulaʻula ʻeleʻele wai | 75±1.0 | 330±30 | 1000-3000 | 2.5 ±0.1 |
| DOPO-NQ hoʻololi phenolic epoxy resin | DFE201A | ʻulaʻula ʻulaʻula ʻeleʻele wai | 75±1.0 | 330 土 10 | 1500-1700 | 2.5 ±0.1 |
| DOPO hoʻololi i ka phenolic epoxy resin | DFE202 | ʻAʻole waihoʻoluʻu i ka wai aniani melemele māmā | 75 ±1.0 | 315±20 | 1000-3000 | 3.1 〜3.2 |
| DOPO hoʻololi i ka phenolic epoxy resin | DFE202A | ʻulaʻula ʻulaʻula ʻeleʻele wai | 70 ±1.0 | 300±20 | <2000 | 2.4±0.1 |
| DOPO hoʻololi i ka phenolic epoxy resin | DFE202B | ʻAʻole waihoʻoluʻu i ka wai aniani melemele māmā | 75±1.0 | 310±20 | ≤3000 | 2.8 〜3.2 |
| DOPO hoʻololi i ka phenolic epoxy resin | DFE202C | ʻO ka wai maʻemaʻe a maopopo | 75±1.0 | 300±20 | <3000 | 3.1 ±0.1 |
| DOPO hoʻololi i ka phenolic epoxy resin | DFE202D | ʻO ka wai aniani melemele māmā | 70±1.0 | 360 土 30 | ≤ 1500 | 2.5 ±0.2 |
ʻO nā epoxy resins brominated he ʻano mea halogen flame retardant epoxy resins.Hoʻokumu kā mākou hui i ka bromine kiʻekiʻe a me ka bromine haʻahaʻa epoxy resin, nona ka permeability maikaʻi i ka lole aniani, ka pale ahi maikaʻi a me ka pale wela, a hoʻohana nui ʻia i ke kula o ka non halogen flame retardant copper clad laminate.
| inoa | Papa No | Ka nana aku | NV (%) | EEW (g/eq) | ʻO ka viscosity (mPa.s) | Br% (%) |
| haʻahaʻa bromine maʻiʻo epoxy resin | DFE271 | ʻEleʻele melemele a ʻulaʻula ʻulaʻula wai aniani | 80±1.0 | 250-280 | 200-800 | 11.5±1.0 |
| DFE274 | ʻEleʻele melemele a ʻulaʻula ʻulaʻula wai aniani | 75±1.0 | 280-320 | 200-1500 | 18-21 | |
| DFE276 | ʻEleʻele melemele a ʻulaʻula ʻulaʻula wai aniani | 75 土 1.0 | 340-380 | 200-400 | 18-21 | |
| DFE277 | ʻEleʻele melemele a ʻulaʻula ʻulaʻula wai aniani | 80±1.0 | 410-440 | 800-1800 | 18-21 | |
| DFE278 | ʻulaʻula ʻulaʻula ʻeleʻele wai | 80±1.0 | 410-440 | 800-1800 | 18-21 | |
| inoa | Papa No | Ka nana aku | EEW (g/eq) | hooluolu kiko (°C) | Br% (%) | |
| kiʻekiʻe bromine maʻiʻo epoxy resin | DFE270 | Paʻa kala ʻole a melemele | 380-420 | 67-74 | 46-50 | |
ʻO ka MDI epoxy resin i hoʻololiʻia he epoxy i hoʻololiʻia e Isocyanate me ka oxazolidinone i hoʻokomoʻia i loko o ke kaulahao nui, a he maikaʻi ke kūpaʻa wela a me ka maʻalahi.Loaʻa ka huahana ma Boron free a me Boron i loaʻa, He mea hiki ke hoʻoheheʻe ʻia i nā solvents maʻamau e like me propylene glycol methyl ether, acetone, butanone, etc. kahua laminate ʻaʻahu keleawe ʻole kepau.
| inoa | Papa No | Ka nana aku | NV (%) | EEW (g/eq) | ʻO ka viscosity (mPa.s) | Br% (%) |
| MDI hoʻololi i ka brominated epoxy resin | DFE204 | ʻulaʻula ʻulaʻula ʻeleʻele wai | 75±1.0 | 330-370 | 500-2000 | 16.5-18 |
| DFE204A | ʻulaʻula ʻulaʻula ʻeleʻele wai | 75±1.0 | 330-370 | 500-2000 | 16.5-18 | |
| MDI hoʻololi epoxy resin | DFE205 | ʻO ka wai aniani ʻeleʻele melemele | 75 ±1.0 | 250-310 | 500-2500 | - |
| DFE205A | ʻO ka wai aniani ʻeleʻele melemele | 75 ±1.0 | 270-330 | 500-2500 | - |
ʻO nā resins epoxy Macromolecular kahi ʻano o ka bisphenol A / F epoxy resins i hoʻololi ʻia, aia nā ʻiʻo mole mole a me nā ʻāpana kaulahao lōʻihi, a loaʻa ka maʻalahi a me ka hoʻopili. hiki ke kahe.He kūpono ia no ka papa kaapuni i pai ʻia, ka laminate copper copper clad, adhesive, composite material, uila laminate a me nā huahana ʻē aʻe.
| inoa | Papa No | Ka nana aku | NV (%) | EEW (g/eq) | ʻO ka viscosity (mPa.s) |
| ʻO ka bisphenol i hoʻololi ʻia A resin epoxy | DFE206 | ʻAʻole waihoʻoluʻu i ka wai aniani melemele māmā | 75 土 1.0 | 470±30 | 500-3000 |
| Hoʻololi ʻia ka bisphenol Fepoxy resin | DFE207 | Melemele māmā a ʻulaʻula ʻulaʻula ka wai aniani | 70±1.0 | 550 ±50 | 500-3000 |
ʻO ka DCPD epoxy resin kahi ʻano linear multifunctional epoxy resin me Dk / DF haʻahaʻa, kūpaʻa wela maikaʻi, haʻahaʻa haʻahaʻa, adhesion kiʻekiʻe a me ke kūpaʻa kemika.Hoʻohana nui ʻia ia i ke alapine kiʻekiʻe a me ke kiʻekiʻe kiʻekiʻe o ka laminate copper clad, nā mea hoʻoheheʻe ʻia, nā uhi pale ahi, nā mea hoʻopili ahi a me nā māla ʻē aʻe.
| inoa | Papa No | EEW (g/eq) | wahi palupalu (°C) | Hy-Cl (ppm) |
| Paʻa DCPD epoxy resin | DFE211LL | 260-275 | 53-60 | <300 |
| DFE211L | 265-275 | 60-70 | <300 | |
| DFE211 | 260-280 | 70-80 | <300 | |
| DFE211H | 260-280 | 80-90 | <300 | |
| DFE211HH | 265-285 | 90-100 | <300 | |
| inoa | Papa No | EEW (g/eq) | NV (%) | ʻO ka viscosity (mPa.s) |
| DCPD epoxy resin solution | DFE210 | 260-280 | 75±1 | 200-800 |
ʻO ka resin epoxy multifunctional he ʻano epoxy resin me ʻekolu a ʻehā paha degere hana.Loaʻa iā ia nā hiʻohiʻona o ke kiʻekiʻe cross-linking density, maikaʻi ke kūpaʻa wela, hoʻōla wikiwiki, ikaika kiʻekiʻe a me ke kūpaʻa kemika maikaʻi loa.Hoʻohana nui ʻia ia i nā kula o ka laminate copper clad laminate a me nā mea hoʻohui.
DFE250
DFE254
DFE256
DFE258
| inoa | Papa No | EEW (g/eq) | kalakala (G) | Hy-Cl (ppm) |
| ʻO ka resin epoxy Tetrafiinctional | DFE250 | 195-230 | ≤18 | - |
| Kiʻekiʻe wela epoxy resin multifunctional | DFE254 | 110-120 | <11 | <1000 |
| DFE256 | 90-110 | <11 | <1000 | |
| ʻO ka resin epoxy trifunctional | DFE258 | 155-175 | <18 | <1000 |
| inoa | Papa No | EEW (g/eq) | NV (%) | ʻO ka viscosity (mPa.s) |
| ʻO ka hopena epoxy resin Tetrafunctional | DFE251 | 200-240 | 70 士 1 | 50-250 |
ʻO ka Crystalline (ke aniani wai) epoxy resin nā hiʻohiʻona o ka viscosity haʻahaʻa, ke kūpaʻa wela, ka wai kiʻekiʻe, ka haʻahaʻa haʻahaʻa o ka hoʻonui laina a me ka haʻahaʻa wai haʻahaʻa, i hoʻohana nui ʻia i ka laminate copper copper clad, composite material a me nā māla ʻē aʻe.
DFE260
DFE261
DFE262
DFE264
| inoa | Papa No | EEW (g/eq) | wahi hehee / palupalu (°C) | Hy-Cl (ppm) | waiwai |
| Biphenyl phenolic epoxy resin | DFE260 | 280-300 | 65-75 | <300 | Dielectric haʻahaʻa, pale wela kiʻekiʻe |
| Biphenyl Liquid Crystalline Epoxy resin | DFE261 | 184-192 | >100 | <300 | Haʻahaʻa viscosity, kiʻekiʻe thermal conductivity |
| BHQBiphenyl Crystalline Epoxy resin | DFE262 | 168-180 | >136 | <300 | Haʻahaʻa viscosity, pale ahi |
| Tetramethylbisphenol F epoxy resin | DFE264 | 190-210 | >69 | <300 | Haʻahaʻa viscosity, haʻahaʻa dielectric |
ʻO ka resin phenolic linear he resin phenolic maikaʻi a maʻemaʻe hoʻi i hoʻomohala ʻia no ka ʻoihana uila.Hōʻike ʻia ia e ka waihoʻoluʻu māmā, ka hāʻawi ʻana i ke kaumaha molecular haʻahaʻa a me ka haʻahaʻa haʻahaʻa haʻahaʻa haʻahaʻa (hiki ke hoʻemi ʻia ka haʻahaʻa i l00ppm).Hoʻohana nui ʻia ia i ka laminate copper clad laminate, semiconductor packaging a me nā māla ʻē aʻe.Eia kekahi, i ka hāʻawi ʻana i nā mea kūʻai aku me nā huahana palupalu kikoʻī, hiki i kā mākou hui ke hāʻawi pū i ka resin butanone solution me ka ʻike paʻa o 60% - 70% e like me ka koi.
| inoa | Papa No | Ka nana aku | hooluolu kiko (°C) | Phenol manuahi (%) | Maʻiʻo Volatile ʻAʻole (%) | like hydroxyl (g/eq) |
| Phenol Formaldehyde Resin | DFE308 | ʻAʻole waihoʻoluʻu a hiki i ka melemele māmā paʻa | 84 土 3 | <0.05 | ≥ 99.5 | 106±2 |
| DFE309 | 95±3 | <0.05 | ≥ 99.5 | 106±2 | ||
| DFE310 DFE311 | 98±3 | ≤0.1 | ≥ 99.5 | 106±3 | ||
| 105 ±3 | ≤0.1 | ≥99.5 | 106±3 | |||
| DFE312 | 115±3 | ≤0.1 | ≥99.5 | 106±3 | ||
| BP He ʻano phenolic resin | DFE322 | Melemele a ʻulaʻula ʻulaʻula paʻa | 122 ±3 | ≤0.1 | ≥99.5 | 118±3 |
ʻO ka phosphorus i loaʻa ka phenolic resin he kiʻekiʻe ka phosphorus maʻiʻo a me ka maikaʻi o ka lapalapa ahi, hiki ke hana i ka hemahema o ka haʻahaʻa haʻahaʻa phosphorus i loko o ka phosphorus i loko o ka epoxy resin.He kūpono ia no ka laminate copper copper clad, capacitor packaging, electrical laminate a me nā māla ʻē aʻe.
| inoa | Papa No | Ka nana aku | NV (%) | P% (%) | ʻO ka viscosity (cps) | like hydroxyl (g/eq) | waiwai |
| ʻO ka phosphorus e hoʻohaumia i ka resin phenolic | DFE392 | ʻO ka wai aniani melemele | 60 ±1.0 | 8.9 〜9.2 | 400—3000 | 360〜400 | Hoʻopaʻa ahi maikaʻi |
| DFE394 | ʻO ka wai aniani melemele | 60 ±1.0 | 8.9 〜9.2 | 3000〜5000 | 320〜360 | ʻO ka hana kiʻekiʻe a me ka pale ahi | |
| DFE395 | ʻO ka wai aniani melemele | 56±1,0 | 8.9 〜9.2 | 1000〜4000 | 320〜360 | ʻO ka hana kiʻekiʻe a me ka pale ahi | |
| D992-2 | Melemele a ʻeleʻele mālohi | 60 ±1,0 | 8,6 〜8.8 | 400—3000 | 320〜360 | ʻO ke kumu kūʻai haʻahaʻa, maikaʻi ka pale ahi | |
| D994 | ʻO ka wai aniani melemele | 60 ±1,0 | 8.9 〜9.2 | 400〜3000 | 320〜360 | ʻO ka hana kiʻekiʻe a me ka pale ahi |
He ʻano koʻikoʻi ʻo Hydrocarbon resin series i ka resin substrate circuit circuit ma 5g kahua.Ma muli o kāna hana kemika kūikawā, maʻamau he dielectric haʻahaʻa, kūpaʻa wela maikaʻi a me ke kūpaʻa kemika.Hoʻohana nui ʻia ia i ka 5g copper clad laminates, laminates, flame retardant material, high temperature resistant insulating paint, adhesives and casting materials.Loaʻa nā huahana i ka resin hydrocarbon i hoʻololi ʻia a me ka haku mele hydrocarbon resin.
ʻO ka resin hydrocarbon i hoʻololi ʻia he ʻano hydrocarbon resin i loaʻa e kā mākou hui ma o ka hoʻololi ʻana i nā mea waiwai hydrocarbon.Loaʻa iā ia nā waiwai dielectric maikaʻi, ʻike vinyl kiʻekiʻe, ikaika peel kiʻekiʻe, a me nā mea ʻē aʻe, a hoʻohana nui ʻia i nā mea kiʻekiʻe.
| inoa | Papa No | Ka nana aku | NV (%) | ʻO ka viscosity (mPa.s) | waiwai |
| Hoʻololi ʻia ka styrene butadiene resin | DFE401 | Wai melemele māmā | 35±2.0 | <3000 | ʻO ke kaumaha molekala kiʻekiʻe a me ka dielectric haʻahaʻa.Hoʻohana nui ʻia i ka resin hydrocarbon, polyphenylene ether a me ka ʻōnaehana resin peek |
| Epoxy resin i hoʻololi ʻia i ka styrene butadiene resin | DFE402 | Wai waihoʻoluʻu a melemele | 60±2.0 | <5000 | ʻO ka epoxy i hoʻololi ʻia e Anhydride me nā waiwai dielectric haʻahaʻa hoʻohana nui ʻia i nā mea kiʻekiʻe-wikiwiki |
| Styrene butadiene resin me nā waiwai dielectric haʻahaʻa | DFE403 | 60±2.0 | <2000 | ʻIke vinyl kiʻekiʻe, kiʻekiʻe crosslinking density, hoʻohana nui ʻia i ka resin hydrocarbon, polyphenylene ether a me ka ʻōnaehana resin peek | |
| ʻO ka resin hydrocarbon i hoʻololi ʻia | DFE404 | 40+2.0 | <2000 | Haʻahaʻa dielectric, haʻahaʻa wai absorption, kiʻekiʻe peel ikaika | |
| ʻO ka resin polystyrene i hoʻololi ʻia | DFE405 | 60 土 2.0 | <3000 | ʻIke vinyl kiʻekiʻe, kiʻekiʻe crosslinking density, hoʻohana nui ʻia i ka resin hydrocarbon, polyphenylene ether a me ka ʻōnaehana resin peek | |
| ʻO ka resin hydrocarbon i hoʻololi ʻia | DFE406 | 35±2.0 | <2000 | Haʻahaʻa wai absorption, kiʻekiʻe peel ikaika, maikaʻi dielectric waiwai | |
| resina hydrocarbon | DFE412 | Wai melemele māmā | 50 土 2.0 | <8000 | Modulus kiʻekiʻe, kaumaha molekala kiʻekiʻe a me ka dielectric haʻahaʻa |
| ʻO resin paʻa pālua me nā waiwai dielectric haʻahaʻa | DFE416 | Wai waihoʻoluʻu a melemele | 60+2.0 | <2000 | ʻIke vinyl kiʻekiʻe, kiʻekiʻe crosslinking density, hoʻohana nui ʻia i ka resin hydrocarbon, polyphenylene ether a me ka ʻōnaehana resin peek |
ʻO ka hydrocarbon resin composite kahi ʻano o ka hydrocarbon resin composite i hoʻomohala ʻia e kā mākou hui no 5g kamaʻilio.Ma hope o ke kuʻi ʻana, hoʻomaloʻo, laminating a me ke kaomi ʻana, loaʻa i ka composite nā waiwai dielectric maikaʻi loa, ka ikaika peel kiʻekiʻe, ke kūpaʻa wela maikaʻi a me ka retardancy ahi maikaʻi.Hoʻohana nui ʻia ia ma 5g base station, antenna, power amplifier, radar a me nā mea kiʻekiʻe kiʻekiʻe.carbon resin i loaʻa e kā mākou hui ma o ka hoʻololi ʻana i nā mea waiwai hydrocarbon.Loaʻa iā ia nā waiwai dielectric maikaʻi, ʻike vinyl kiʻekiʻe, ikaika peel kiʻekiʻe, a me nā mea ʻē aʻe, a hoʻohana nui ʻia i nā mea kiʻekiʻe.
| inoa | Papa No | Ka nana aku | NV (%) | waiwai |
| ʻO ka hoʻohui ʻana i ka resin hydrocarbon | DFE407 | He wai keʻokeʻo a melemele | 65 ±2.0 | Dk/Df: 3.48/0.0037 Hoʻohana nui ʻia i ka mana hoʻonui (V0) |
| DFE407A | 65 ±2.0 | Dk: 3.52 High fluidity, hoʻohana nui ʻia i ka hana ʻana o ka adhesive pepa | ||
| DFE408 | 65 ±2.0 | Dk/Df: 3.00/0.0027 Hoʻohana nui ʻia ma ke kahua kahua a me ka antenna (papa multilayer, flame retardant V0) | ||
| DFE408A | 65 ±2.0 | Dk: 3.00 High fluidity, hoʻohana nui ʻia i ka hana ʻana o ka adhesive pepa | ||
| DFE409 | 65 ±2.0 | Dk/Df: 3.30/0.0027 Hoʻohana nui ʻia i ka antenna (papa ʻelua ʻaoʻao, non flame retardant V0) | ||
| DFE410 | 65 ±2.0 | Dk/Df: 3.40/0.0029 Hoʻohana nui ʻia i ka antenna (papa ʻelua ʻaoʻao, non flame retardant V0) | ||
| DFE411 | 65 土 2.0 | Dk/Df: 3.38/0.0027 Hoʻohana nui ʻia i ka mana amplifier (non flame retardant) |
Hoʻopili ʻo ia i ka mea hoʻōla ester ikaika me ka resin epoxy e hana i ka pahu me ka ʻole o ka hui hydroxyl waiʻona lua.Loaʻa i ka ʻōnaehana hoʻōla nā hiʻohiʻona o ka haʻahaʻa wai haʻahaʻa a me Dk / Df haʻahaʻa.
| inoa | Papa No | helehelena | Ester like | NV (%) | Viscosity (卬s) | wahi palupalu rc) |
| Mea ho'ōla ester haʻahaʻa haʻahaʻa | DFE607 | ʻO ka wai viscous ʻeleʻele māmā | 230〜240 | 69 ±1.0 | 1400〜1800 | 140〜150 |
| DFE608 | wai ʻulaʻula ʻulaʻula | 275-290 | 69±1.0 Loaʻa nā paʻa | 800-1200 | 140-150 | |
| DFE609 | wai ʻulaʻula | 275-290 | 130-140 | |||
| DFE610 | wai ʻulaʻula | 275-290 | 100-110 |
ʻOi aku ka nui o ka phosphorus ma mua o 13%, ʻoi aku ka nui o ka nitrogen ma mua o 6%, a maikaʻi ke kūpaʻa hydrolysis.He kūpono ia no ka laminate copper copper clad, capacitor packaging a me nā māla ʻē aʻe.
ʻO ka BIS-DOPO ethane kahi ʻano o nā mea hoʻohuihui phosphate, ʻaʻohe halogen-free environmental flame retardant.ʻO ka huahana he pauda keʻokeʻo paʻa.He maikaʻi loa ka paʻa wela a me ka paʻa kemika, a ʻoi aku ka mahana o ka decomposition ma luna o 400 °C.ʻO kēia huahana he mea hiki ke pale i ke ahi a me ke kaiapuni.Hiki iā ia ke hoʻokō piha i nā koi kaiapuni o ka European Union.Hiki ke hoʻohana ʻia ma ke ʻano he pale ahi ma ke kahua o ka laminate ʻaʻahu keleawe.Eia kekahi, ʻoi aku ka maikaʻi o ka huahana me ka polyester a me ka nylon, no laila he maikaʻi loa ka spinnability i ke kaʻina wili, maikaʻi ka wili mau a me nā waiwai kala, a hoʻohana nui ʻia i ke kula o ka polyester a me ka nylon.
| inoa | Papa No | Ka nana aku | hehee ana kiko (℃） | P% % | N% (%) | Td5%（℃） | Waiwai |
| ʻO Phosphazene pale ahi | DFE790 | Pauka lepo keʻokeʻo a melemele paha | 108 ±4.0 | ≥13 | ≥6 | ≥320 | ʻO nā mea phosphoms kiʻekiʻe, ka pale ahi, ke kūpaʻa wela kiʻekiʻe, ke kūpaʻa hydrolysis, kūpono no ka laminate ʻaʻahu keleawe a me nā māla ʻē aʻe. |
| inoa | Papa No | Ka nana aku | maʻiʻo % | hehee ana kiko CC) | P% % | Td2% V | Waiwai |
| BIS-DOPO etana | DFE791 | Pauda keʻokeʻo | ≥99 | 290-295 | ≥13 | ≥400 | Maʻiʻo ion Chloride< 20ppm, wahi hehee kiʻekiʻe, mānoanoa pohā kiʻekiʻe, haʻahaʻa e^ansion coefficient |
ʻO DFE930n DFE936> DFE937, DFE939 ^ DFE950 a me DFE952 he mau resins maleimide uila me ka maʻemaʻe kiʻekiʻe, ka liʻiliʻi o nā haumia a me ka solubility maikaʻi.Ma muli o ke ʻano o ke apo imine i loko o ka mole, he ikaika ko lākou rigidity a me ke kūpaʻa wela maikaʻi.Hoʻohana nui ʻia lākou i nā mea aerospace structural, carbon fiber kiʻekiʻe kiʻekiʻe wela structural ʻāpana, kiʻekiʻe kiʻekiʻe wela impregnating pena, laminates, copper clad laminates, molded plastics, etc. nā mea hana, nā ʻāpana hoʻolei a me nā mea iunctional ʻē aʻe a me nā māla ʻenehana kiʻekiʻe.
| inoa | Papa NO | Ka nana aku | hehee kiko (℃) | Waiwai ʻakika ( mg KOH/g) | Huʻihuʻi maʻiʻo (%) | (5mm) Hoʻoheheʻe ʻia o toluene wela (5min) | Waiwai |
| Bismaleimide papa uila | DFE928 | Nā ʻāpana paʻa melemele | 158±2 | ≤3.0 | ≤0.3 | Hiki ke hoʻoheheʻe ʻia | Kūleʻa wela kiʻekiʻe |
| ʻO ka diphenylmethane Bismaleimide papa uila | DFE929 | Nā ʻāpana paʻa melemele māmā | 162 ±2 | ≤1.0 | ≤0.3 | ʻO ka maʻemaʻe kiʻekiʻe a me ka waiwai haʻahaʻa o ka waikawa | |
| Bismaleimide papa uila | DFE930 | ʻO ka pauka keʻokeʻo melemele māmā | 160 ±2 | ≤1.0 | ≤0.3 | Maʻemaʻe kiʻekiʻe aad haʻahaʻa acid^lue | |
| Bismaleimide kristal haʻahaʻa | DFE936 | 168 ±2 | ≤1.0 | ≤0.3 | Hoʻoheheʻe maikaʻi | ||
| Haʻahaʻa crystalline a haʻahaʻa dielectric Bismaleimide | DFE937 | 168 ±2 | ≤1.0 | ≤0.3 | Hoʻoheheʻe maikaʻi | ||
| Phenyl bismaleimide me ka helu heheʻe haʻahaʻa | DFE939 | Paʻa ʻeleʻele māmā a i ʻole ka pauka paʻa melemele | 50 土 10 | ≤3.0 | ≤0.3 | Hoʻoheheʻe maikaʻi | |
| polymaleimide wahi hoohehee haahaa | DFE950 | 50 ±10 | ≤3.0 | ≤0.3 | Hoʻoheheʻe maikaʻi | ||
| Tetramaleirnide wahi meltmg haʻahaʻa | DFE952 | 50 ±10 | ≤3.0 | ≤0.3 | Hoʻoheheʻe maikaʻi |
